ORSPI4 Datasheet, PDF (1/263 Pages) Lattice Semiconductor – Dual SPI4 Interface and High-Speed SERDES FPSC

ORCA^® ORSPI4
Dual SPI4 Interface
and High-Speed SERDES FPSC
October 2007
Data Sheet
Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on
the Series 4 reconfigurable embedded System-on-a-Chip (SoC) architecture, the ORSPI4 FPSC contains two
SPI4.2 interface blocks, a high-speed Memory Controller, four channels of 0.6-3.7 Gbits/s SERDES with 8b/10b
encoding and decoding and over 600K programmable system gates all on a single chip.
Embedded SPI4 Core Features
■ OIF-SPI4-02.0 compliant interfaces
■ Dynamic timing receive interface:
• Full bandwidth up to 450 MHz DDR (900
Mbits/s) for all speed grades.
• Bit de-skewing up to 16 phases of the clock
• Capable of aligning bit-to-bit skews as large as
±1 bit periods
■ Static timing receive interface:
• Speeds up to 325 MHz DDR (650 Mbits/s), for
all speed grades, including Quarter-Rate mode
• Clock aligned or clock centered modes sup-
ported
■ DIP-4 and DIP-2 parity generation and checking
■ Transmit Interface:
• Speeds up to 450 MHz DDR (900 Mbits/s)
• Dedicated LVDS transmit interface for improved
data eye integrity
• Automatic idle insertion
■ 256 logical ports:
• Embedded Calendar-based sequence port poll-
ing mechanism and bandwidth allocation.
Shadow Calendar support for smooth transition
to new Calendar
• Up to 32 independent TX and 32 independent
RX buffers per SPI4 interface internally. Various
aggregation modes to support 1 to 32 separate
embedded buffers per TX and RX
• Up to 4 independent TX and 4 independent RX
clock domain transfers to the FPGA logic
■ FIFO status support modes:
• 1/4 rate LVTTL or 1/4 rate LVDS
• Automatic status handling or optionally under
user control. Credit calculations based on burst
size and status are also handled automatically
■ Configuration options as suggested in the OIF-
SPI4-02.0 standard
• Configures parameters such as maximum burst
size, calendar length, main and shadow calen-
dars (1K deep each), length of training
sequence etc.
■ Simple FIFO interface to the FPGA logic
• Provides ease of design and efficient clock
domain transfers
■ Loopback modes provided for system- and
chip-level debug
■ Embedded 32-bit internal system bus plus 4-bit
parity
• Interconnects FPGA logic, microprocessor inter-
face (MPI), embedded RAM blocks, and embed-
ded core blocks
• Includes built-in system registers that act as the
control and status center for the device
■ Low power operation.
• Full-rate SPI4.2 interfaces running at 450 MHz
DDR (900 Mbits/sec) with dynamic alignment
consumes 1.5 W of power or less. More efficient
than FPGAs with soft-IP SPI4 solutions which
consume in excess of 10 W.
■ Programmable Minburst capability with
selectable burst values ranging from 16 to 240.
■ Interoperability demonstrated with ORSPI4
partners.
Embedded SERDES Core Features
■ Quad 600 Mbits/s to 3.7 Gbits/s SERDES:
• IEEE 802.3ae XAUI (Link State Machine &
Alignment FIFOs embedded)
• ANSI X3.230:1994 1G/2G FC-compliant (Link
State Machine & Alignment FIFOs embedded)
• Proven performance (same SERDES used in
ORT82G5/ORT42G5 FPSCs)
Embedded Memory Controller Features
■ High Performance Memory Controller for
interface to external buffer memory
• Required for Layer 2 data buffering
• QDR II memory interface:
– 36-bit Input and 36-bit Output bus, 18-bit address
– 175 MHz clock rates
– 20+ Gbits/s bandwidth
– Supports 2- or 4-word burst mode
– Simple FIFO interface to FPGA
– Integrated PLL for optimized performance
– Proven performance with multiple memory suppliers
Note: The term SPI4 refers to OIF SPI-4.2 throughout this document
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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