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ML13155 Datasheet, PDF (16/16 Pages) LANSDALE Semiconductor Inc. – Wideband FM IF | |||
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ML13155
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
SOâ16 = -5P
(ML13155-5P)
PLASTIC PACKAGE
CASE 751B
(SOâ16)
âA
â
16
1
9
âB
â
8
P 0.25 (0.010) M B M
8 PL
G
SEATING
PLANE
âT
â
D16 PL
0.25 (0.010) M T B S A S
C
K
R X 45
M
F
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. 751Bâ03 IS OBSOLETE, NEW STANDARD
751Bâ04.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G
1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M
0
7
0
7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. âTypicalâ parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including âTypicalsâ must be validated for each customer application by the customerâs
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
Page 16 of 16
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