SA1316-H Datasheet, PDF (2/4 Pages) KODENSHI KOREA CORP. – Low power consumption type chip LED

AUK CORP.
SA1316-H
4. Absolute Maximum Ratings
(Ta=25^oC)
Characteristic
Symbol
Rating
Unit
Power dissipation
P_D
60
mW
Forward current
I_F
25
mA
*1 Peak forward current
I_FP
50
mA
Reverse voltage
V_R
4
V
Operating temperature range
T_opr
∼ -25 80
°C
Storage temperature range
T_stg
∼ -30 100
°C
*2 Soldering temperature
T_sol
*1. Duty ratio = 1/16, Pulse width = 0.1ms
240°C for 10 seconds
℃ ℃ ℃ *2. Recommended reflow soldering temperature profile
- Preheating 150 to 185 within 120 seconds soldering 240 within
10 seconds Gradual cooling (Avoid quenching)
℃ Temp ( )
240
185
150
℃ Peak Temp max. 240
max. 10sec
℃ ^{Preheating area}
150~185 , 90±30sec
℃^{Solder area}
220 , max. 60sec
℃ max. 3 /sec
℃ max. -6 /sec
℃ max. 4 /sec
℃ Time from 25 to Peak Temperature max. 6min
25
0
60
150 180
240 Time (sec)
The contents of this data sheet are subject to change without advance notice for the purpose of improvement.
When using this product, would you please refer to the latest specifications.
Rev.O date: 08-AUG-11
AUK-LDM-001(A)