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ML615 Datasheet, PDF (1/3 Pages) KODENSHI KOREA CORP. – Available to be mounted on the PCB backside | |||
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赤å¤çºå
ãã¤ãªã¼ã INFRARED EMITTING DIODES(GaAlAs)
ML615
ML615ã¯ã樹èã¬ã³ãºä»ãã®è¡¨é¢å®è£
ã¿ã¤ãã®GaAlAs赤å¤çºå
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ML615 is a surface mount type GaAlAs infrared emitting diode with resin lens.
ç¹é· FEATURES
â 樹èã¬ã³ãºä»ãããã±ã¼ã¸ãåå¤è§ ±20°
Package with resin lens, half angle±20°
â å°å èåé¢å®è£
ããã±ã¼ã¸ã3.2(L) x 1.5(W) x 2.0(H) mm
Small thin SMD package, 3.2(L) x 1.5(W) x 2.0(H) mm
â å®è£
åºæ¿ã®è£é¢ããã®æè¼ãå¯è½
Available to be mounted on the PCB backside
â éããªã¼ã¯ãã ãªããã¼å®è£
対å¿
Pb free, reflow soldering available
ç¨é APPLICATIONS
CCDãé²ç¯ã«ã¡ã©ãæè¦ã«ã¡ã©ã®å
æº
Light source for CCD, Security camera, Night vision device
æ大å®æ ¼ MAXIMUM RATINGS
ï¼Taï¼25âï¼
Item
Symbol Rating Unit
é é» å§ Reverse Voltage
VR
4
V
é é» æµ Forward Current
IF
ã ã« ã¹ é é» æµ Pulse Forward Current IFP
50
mA
0.8 *1 A
許 容 æ 失 Power Dissipation
å ä½ æ¸© 度 Operating Temp.
PD
70
mW
Topr. -20ï½+70*2 â
ä¿ å 温 度 Storage Temp.
Tstg. -30ï½+90 â
ã¯ãã ä»ã温度 Soldering Temp.
Tsol.
260
â
ï¼1. ãã«ã¹å¹
100μsããã«ã¹å¨æã10msã[ãã¥ã¼ã㣠1%]
Pulse width=100μs, Pulse period=10ms [Duty=1%]ã
ï¼2. çµé²ç¡ããã¨
No dew
é»æ°çå
å¦çç¹æ§ ELECTRO-OPTICALãCHARACTERISTICS
Item
é
é»
å§ Forward Voltage
é
é»
æµ Reverse Current
ã 㼠㯠æ 度 æ³¢ é· Peak Emission Wavelength
ã¹ ã 㯠ã ã« å å¤ è§ Spectral Bandwidth 50%
çº å
åº å Radiant Intensity
å
å¤
è§ Half Angle
ï¼3. å¼ç¤¾æ¤æ»æ©ã®åºåå¤
Measured by tester of KODENSHI CORP.
Symbol
VF
IR
λP
â³Î»
Po
â³Î¸
Conditions
IF=20mA
VR=4V
IF=50mA
IF=50mA
IF=20mA
â
Min.
â
â
â
â
ï¼3 (2.3)
â
Typ.
1.4
â
875
45
2.8
±20
ï¼Taï¼25âï¼
Max. Unit
(1.6)
V
10
μA
â
nm
â
nm
(3.3) mW
â
deg
å¤å½¢å¯¸æ³ DIMENSIONS ï¼Unit : mmï¼
Cathode Mark 1.5
Cathode
2.0
0.75 0.5
R0.75
Anode
æ¨å¥¨ã©ã³ããã¿ã¼ã³ã
ã¹ã¯ãªã¼ã³å°å·ã®ã¡ã¿ã«ãã¹ã¯ã¨ãã¦ã¯0.2mmï½
0.3mmåãæ¨å¥¨ãã¾ããä½ãããªããã¼æ¡ä»¶ã»ã¯ãã
ãã¼ã¹ãï½¥åºæ¿ææçã«ããã¯ãã ä»ãæ§ãå¤å
ããäºãããã¾ãã®ã§ãå®ä½¿ç¨æ¡ä»¶ã«ã¦ç¢ºèªã®
ä¸ãã使ç¨ä¸ããã
The thickness recommended as a metal mask of the
screen printing is 0.2mm - 0.3mm. However, please
check the actual use conditon beforehand, because
solderability is variable depending on the actual reflow
conditions, type of solder pastes, or substrate materials.
(1.5)
æ¬è³æã«è¨è¼ãã¦ããã¾ãå
容ã¯ãæè¡ã®æ¹è¯ãé²æ©çã«ãã£ã¦äºåãªãã«å¤æ´ããããã¨ãããã¾ããã使ç¨ã®éã«ã¯ãä»æ§æ¸ããç¨å½ã®ä¸ãå
容ã®ç¢ºèªããé¡ãè´ãã¾ãã
The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, please refer to the latest specifications.
Jun.2014
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