NPO0402A Datasheet, PDF (13/13 Pages) KOA Speer Electronics, Inc. – Ceramic Chip Capacitors

KOA SPEER ELECTRONICS, INC.
TN-196 R12
18. Carrier Tape Specifications
10 pitches cumulative
tolerance on tape
±0.008 (±0.2)
P0
Punched paper tape
T
8 & 12mm
D0
P2
E
Bottom
cover
tape
Top
cover
tape
B0
T1
Cavity size,
A0
P1
T1
see note 1
Center lines
User direction of feed
of cavity
F
W
G1
G2
19. Dimensions
Dimensions in inches (mm)
Tape Size
Constant
8mm
and
12mm
Tape Size
Variable
8mm
12mm
D0
.059
±
-
.004
.000
(1.5
±
-
0.1
0.0
)
E
.069 ± .004
(1.75 ±0.10)
P0
.157 ± .004
(4.0 ± 0.10)
P1
.157 ± .004
(4.0 ± 0.10)
.157 ± .004
(4.0 ± .010)
F
.138 ± .002
(3.5 ± 0.05)
.217 ± .002
(5.5 ± 0.05)
P2
.079 ± .002
(2.0 ± 0.05)
T1
.004
(0.10)
Max.
W
.315
±
-
.012
.004
(8.0
±
-
0.3
0.1
)
.472 ± .012
(12.0 ± 0.3)
G1
.030
(0.75)
Min.
G2
.030
(0.75)
Min.
A0B0
R MIN
.984
(25)
See note 2
T
See note 1
See note 2
Notes:
1. A0, B0 and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions
of the component. The clearance between the ends of the terminals or body of the components to the sides and depth of the cavity (A0, B0
and T) must be within .002" (0.05) mm min. and .020" (0.50) mm max. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see examples C & D).
2. Tape with components shall pass
20° Maximum Component Rotation
around radius "R" without damage.
3. .043" (1.1) mm base tape and .063" (1.6) mm max. _20°
for non-paper base compositions.
T
B_O
Typical component
cavity center line
Maximum Component Rotation
Side or Front Sectional View
Example "C"
Typical component
A_O
center line
Top View Example "D"
20. Recommended Land Pattern Dimensions
Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering.
Pad dimensions are given below for multilayer ceramic capacitors for both reflow and wave soldering. The basis for these designs is:
• Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this.
• Pad overlap 0.5mm beneath component
• Pad extension 0.5mm beyond components
for reflow and 1.0mm for wave soldering
C
D
B
C
A
22-1 Reflow Soldering
Case Size A* B* C* D*
0402 0.50 1.70 0.60 0.50
0603 0.75 2.30 0.80 0.70
0805 1.25 3.00 1.00 1.00
1206 1.60 4.00 1.00 2.00
1210 2.50 4.00 1.00 2.00
22-2 Wave Soldering
Case Size A* B* C* D*
0805 1.25 4.00 1.50 1.00
1206 1.60 5.00 1.50 2.00
1210 2.50 5.00 1.50 2.00
* All dimensions are in millimeters unless otherwise specified.
PAGE 13 OF 13
Bolivar Drive ^■ P.O. Box 547 ^■ Bradford, PA 16701 ^■ USA ^■ 814-362-5536 ^■ Fax [phone] ^■ www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.