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DNAG20TTEB Datasheet, PDF (1/2 Pages) KOA Speer Electronics, Inc. – diode terminator network
DN(X)
diode terminator network
EU
features
• Fast reverse recovery time
• Fast turn on time
• Low capacitance
• SMD packages
• 16 kV IEC61000-4-2 capable
• Products with lead-free terminations meet EU RoHS
and China RoHS requirements
dimensions and construction
S03
S06
L
P
W
Si
Wafer
Molded
Resin
Lp
W
Si
Wafer
Molded
Resin
S04
L
Bonding
p
Wire
Package Total
Code Power
Bonding
Wire
S03 225mw
Die
Pad
Lead
d
W
Die
Si Pad
Wafer
Molded
Resin
N08, Q20,
Q24
L
Bonding
Wire
Lead
d
S04 225mw
S06 225mw
N08 400mw
Bonding
Wire
d
Q20 1000mw
Q24 1000mw
Lead
d
Die
Pad
p
W
Lead
Die
Si Pad
Molded Wafer
Resin
Pins
3
4
6
8
20
24
L ±0.2
.115
(2.92)
Dimensions inches (mm)
W ±0.2 p ±0.1
Pkg Ht
±0.2
d ±0.05
.091 .075 .037 .017
(2.30) (1.91) (0.95) (0.43)
.115 .091 .075 .037 .017
(2.92) (2.30) (1.91) (0.95) (0.43)
.115 .110 .037 .037 .017
(2.92) (2.80) (0.95) (0.95) (0.43)
.190 .236 .050 .063 .016
(4.83) (5.99) (1.27) (1.60) (0.41)
.341 .236 .025 .063 .010
(8.66) (5.99) (0.635) (1.60) (0.25)
.341 .236 .025 .063 .010
(8.66) (5.99) (0.635) (1.60) (0.25)
circuit schematic
1
DNA: 20 pins
1
DN2: 20 pins
1
DN3: 6 pins
1
DN4: 4 pins
1
DN5: 24 pins
1
1
DN6: 8 pins
DN7: 24 pins
For further information on packaging, please refer to Appendix A.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
12/28/10
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
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