SPM0405HE4H Datasheet, PDF (9/11 Pages) Knowles Electronics – Halogen Free Enhanced RF Protected Digital Mini SiSonic Microphone Specification

SPM0405HE4H
11. MAXIMUM SOLDER REFLOW PROFILE
170–180°C
230°C
Pre-heat
120 sec.
Solder Melt
100 sec.
260°C
Stage
Pre-heat
Solder Melt
Peak
Temperature Profile
170 ~ 180 C
Above 230 C
260 C maximum
Time (maximum)
120 sec.
100 sec.
30 sec.
Notes:
1.
Do not pull a vacuum over the port hole of the microphone. Pulling a
vacuum over the port hole can damage the device.
2.
Do not board wash after the reflow process. Board washing and
cleaning agents can damage the device. Do not expose to ultrasonic
processing or cleaning.
3.
Number of Reflow = recommend no more than 3 cycles.
12. ADDITIONAL NOTES
(A) Packaging (reference SiSonic_Packaging_Spec.pdf)
(B) Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened
ESD moisture sensitive bag under maximum environmental conditions of 30ºC, 70% R.H.
(C) Exposure: Devices should not be exposed to high humidity, high temperature environment.
MSL (moisture sensitivity level) Class 2A.
(D) Out of bag: Maximum of 90 days out of ESD moisture sensitive bag, assuming maximum
conditions of 30ºC/70% R.H.
CONFI DENTI AL – DO NOT DI STRI BUTE
Knowles Acoust ics, a division of Knowles
Elect r onics, LLC.
Revision: D
9 of 11