B080MB5S Datasheet, PDF (2/2 Pages) Dielectric Laboratories, Inc. – 8GHz Surface Mount Bandpass Filter

2 to 18 GHz SM Bandpass Filters
Soldering Information
DLI solderable components are compatible with both
SnPb and 100% Sn mounting methods. Unless otherwise
specified, component termination metal is Ni/Au. Gold
layer is less than 6 micro-inch to eliminate any Au
embrittlement concern. A detailed application note is
available at dilabs.com.
Use of Silver Loaded Epoxy Adhesives
Use of conductive epoxy in place of solders is not
recommended on our solder surface mountable
components. Isolation must be maintained between the
ground plane and signal traces when mounted on PCB.
Epoxy may bleed out and degrade performance.
Board Layout Design (SMT)
Board layout for each surface mountable device will
require a ground plane with RF I/O traces. Each catalog
part number may require a different PCB pattern
recommendation and the individual datasheet and pattern
recommendation should be reviewed. Devices are designed
for a single ended 50 ohm system unless otherwise stated.
Proper transmission line impedance is required to meet
published electrical specifications.
Published test data of component on Rogers RO4350B^® 10
mil thick material. Components were designed to work with
other board materials when source impedance are matched
to 50Ω. Please contact DLI Applications Engineering with
any questions on use of other RF layer.
See dilabs.com for more detailed application note on board
mounting recommendations.
RoHS
All products are RoHS compliant.
Chip and Wire Information
DLI wire bond devices are designed for silver loaded
epoxy adhesives to ground plane. A wire bond to I/O
pad with thermo compression ball or wedge bonding on
MIL-STD gold thickness (min 50 micro-inch). Device is
also compatible with standard die attach methods but not
compatible with Sn or SnPb solderable methods. Follow
typical microwave wire bonding practices to minimize
added inductance that may adversely impact electrical
performance.
Packaging
Components will be packaged in best standard commercial
practices unless otherwise noted or requested. Packaging
options include bulk and tape and reel.
Handling & Storage
Components should never be handled with fingers;
perspiration and skin oils can inhibit solderability or wire
bond ability and will aggravate cleaning.
Ceramic components should never be handled with metallic
instruments. Metal tweezers should never be used as these
can chip the product and leave abraded metal tracks on
the product surface. Plastic, carbon fiber and plastic coated
metal types are readily available and recommended.
Devices are designed to withstand typical storage
conditions. Devices may be stored between -55°C and
+125°C and in a non-condensing environment.
Taped product should be stored out of direct sunlight, which
might promote deterioration in tape performance.
Product, stored under the conditions recommended above,
in its “as received” packaging, has a minimum shelf life of
2 years.
Knowles (Cazenovia)
2777 Route 20 East, Cazenovia, NY 13035
Phone: [phone] | Email: [e-mail] | www.dilabs.com
9629-1/15