AT5050SE9ZS-RV Datasheet, PDF (9/10 Pages) Kingbright Corporation – 5.0X5.0mm SMD LED WITH CERAMIC SUBSTRATE

5.0X5.0mm SMD LED WITH CERAMIC SUBSTRATE
Designing the Position of LED on a Board.
1.No twist/warp/bent/or other stress shall be applied to the board after mounting LED with
solder to avoid a crack of LED package.
Refer to the following recommended position and direction of LED.
Appropriate LED mounting is to place perpendicularly against the stress affected side.
2.Depending on the position and direction of LED,the mechanical stress on the LED package can be changed.
Refer to the following figure.
3.Do not split board by hand.Split with exclusive special tool.
4.If an aluminum circuit board is used,a large stress by thermal shock might cause a solder crack.
For this reason,it is recommended an appropriate verification should be taken before use.
SPEC NO: DSAI5830
APPROVED: WYNEC
REV NO: V.1
CHECKED: Allen Liu
DATE: SEP/22/2008
DRAWN: Y.F.Lu
PAGE: 9 OF 10
ERP: 1212000028