W2344EP Datasheet, PDF (5/10 Pages) Keysight Technologies – 3D Electromagnetic Modeling

Typical EMPro Applications
IC packages
The performance of an RFIC, monolithic microwave integrated circuits (MMIC),
high-speed IC, or system-in-package (SIP) is directly impacted by the effects
of packaging, including wire bonds and solder balls/bumps. Traditionally,
designers had to draw and analyze packages in a separate, 3D EM tool and then
laboriously import the results back to the IC or SIP circuit-design environment
for a combined analysis. With EMPro, you can efficiently create 3D package
structures that can be combined with 2D circuit layouts in ADS. This allows
co-design of the IC, package, laminate, and module with circuit simulation and
3D EM simulation in a streamlined design flow.
Multi-layer RF modules
RF modules typically are constructed from multi-layer ceramic or laminate
dielectric material with embedded RF passive components between the layers.
Such dielectric brick structures cannot be accurately solved by planar EM
simulators, which assume infinite dielectric layers and do not account for edge
proximity fringing. The embedded RF components are drawn by RF circuit layout
macros which would be very time consuming to reproduce in a standalone 3D
EM tool. Full 3D EM simulation integrated within the circuit design flow is the
ideal solution for these applications.
RF components
RF board designs include 3D components and connectors that need to be
characterized to high frequencies. Components such as resonators are sensitive
to interactions with the surrounding PC board traces and vias. Such 3D
components can be created and simulated in EMPro and then combined with a
board layout in ADS for complete 3D EM simulation.
Aerospace/Defense
FDTD simulation has extremely high capacity and can handle large
problems found in aerospace/defense applications. For example, FDTD can be
used to optimize antenna placement in aircraft and perform Radar Cross Section
analysis.
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