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IRFR4105PBF Datasheet, PDF (2/10 Pages) International Rectifier – HEXFET Power MOSFET | |||
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IRFR/U4105PbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
âV(BR)DSS/âTJ
RDS(on)
VGS(th)
gfs
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
55 âââ âââ V VGS = 0V, ID = 250µA
âââ 0.052 âââ V/°C Reference to 25°C, ID = 1mA
âââ âââ 0.045
VGS = 10V, ID = 16A Â
2.0 âââ 4.0 V VDS = VGS, ID = 250µA
6.5 âââ âââ S VDS = 25V, ID = 16AÂ
âââ âââ 25
âââ âââ 250
µA VDS = 55V, VGS = 0V
VDS = 44V, VGS = 0V, TJ = 150°C
âââ âââ 100 nA VGS = 20V
âââ âââ -100
VGS = -20V
âââ âââ 34
ID = 16A
âââ âââ 6.8 nC VDS = 44V
âââ âââ 14
VGS = 10V, See Fig. 6 and 13 ÂÂ
âââ 7.0 âââ
VDD = 28V
âââ 49 âââ ns ID = 16A
âââ 31 âââ
RG = 18â¦
âââ 40 âââ
RD = 1.8â¦, See Fig. 10 ÂÂ
Between lead,
D
âââ 4.5 âââ nH 6mm (0.25in.)
âââ 7.5 âââ
from package
G
and center of die contactÂ
S
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
âââ 700 âââ
âââ 240 âââ
âââ 100 âââ
VGS = 0V
pF VDS = 25V
Æ = 1.0MHz, See Fig. 5Â
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) ÂÂ
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse RecoveryCharge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
âââ âââ 27Â
A showing the
integral reverse
G
âââ âââ 100
p-n junction diode.
S
âââ âââ 1.6 V TJ = 25°C, IS = 16A, VGS = 0V Â
âââ 57 86 ns TJ = 25°C, IF = 16A
âââ 130 200 nC di/dt = 100A/µs ÂÂ
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
 VDD = 25V, starting TJ = 25°C, L = 410µH
RG = 25â¦, IAS = 16A. (See Figure 12)
 ISD ⤠16A, di/dt ⤠420A/µs, VDD ⤠V(BR)DSS,
TJ ⤠175°C
 Pulse width ⤠300µs; duty cycle ⤠2%
Â
Calculated continuous current based on maximum allowable junction
temperature; Package limitation current = 20A
 This is applied for I-PAK, Ls of D-PAK is measured between lead and
center of die contact
 Uses IRFZ34N data and test conditions
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
2
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