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AO3401A Datasheet, PDF (2/5 Pages) Alpha & Omega Semiconductors – P-Channel Enhancement Mode Field Effect Transistor
Electrical Characteristics (TJ=25°C unless otherwise noted)
KSM3401A
Symbol
Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
ID=-250µA, VGS=0V
-30
IDSS
Zero Gate Voltage Drain Current
VDS=-30V, VGS=0V
TJ=55°C
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±12V
VGS(th) Gate Threshold Voltage
VDS=VGS ID=-250µA
-0.5
ID(ON)
On state drain current
VGS=-10V, VDS=-5V
-27
VGS=-10V, ID=-4.0A
RDS(ON) Static Drain-Source On-Resistance
TJ=125°C
VGS=-4.5V, ID=-3.5A
VGS=-2.5V, ID=-2.5A
gFS
Forward Transconductance
VDS=-5V, ID=-4.0A
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
V
-1
µA
-5
±100 nA
-0.9 -1.3 V
A
41
50
mΩ
62
75
47
60 mΩ
60
85 mΩ
17
S
-0.7 -1
V
-2
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=-15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
645
pF
80
pF
55
pF
4
7.8 12
Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
14
nC
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
7
nC
VGS=-10V, VDS=-15V, ID=-4.0A
1.5
nC
Qgd
Gate Drain Charge
2.5
nC
tD(on)
Turn-On DelayTime
6.5
ns
tr
Turn-On Rise Time
VGS=-10V, VDS=-15V, RL=3.75Ω,
3.5
ns
tD(off)
Turn-Off DelayTime
RGEN=3Ω
41
ns
tf
Turn-Off Fall Time
9
ns
trr
Body Diode Reverse Recovery Time IF=-4.0A, dI/dt=100A/µs
11
ns
Qrr
Body Diode Reverse Recovery Charge IF=-4.0A, dI/dt=100A/µs
3.5
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.
2014-5-28
2
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