MBR10H45 Datasheet, PDF (1/3 Pages) Kersemi Electronic Co., Ltd. – Plastic package has Underwriters Laboratory Flammability Classification 94 V-0

MBR10Hxx, MBRF10Hxx & MBRB10Hxx Series
ITO-220AC (MBRF10Hxx)
TO-220AC (MBR10Hxx)
0.415 (10.54) MAX.
0.370 (9.40)
0.360 (9.14)
0.154 (3.91)
DIA.
0.148 (3.74)
0.113 (2.87)
0.103 (2.62)
0.145 (3.68)
0.135 (3.43)
0.160 (4.06)
0.140 (3.56)
0.410 (10.41)
0.390 (9.91)
PIN
1
2
0.635 (16.13)
0.625 (15.87)
0.350 (8.89)
0.330 (8.38)
1.148 (29.16)
1.118 (28.40)
0.105 (2.67)
0.095 (2.41)
0.205 (5.20)
0.195 (4.95)
PIN 1
PIN 2
CASE
0.560 (14.22)
0.530 (13.46)
0.037 (0.94)
0.027 (0.68)
0.022 (0.56)
0.014 (0.36)
0.185 (4.70)
0.175 (4.44)
0.055 (1.39)
0.045 (1.14)
0.603 (15.32)
0.573 (14.55)
0.110 (2.79)
0.100 (2.54)
TO-263AB (MBRB10Hxx)
0.411 (10.45)
0.380 (9.65)
0.190 (4.83)
0.160 (4.06)
0.245 (6.22)
MIN
K
0.055 (1.40)
0.045 (1.14)
0.360 (9.14)
0.320 (8.13)
1K2
0.624 (15.85)
0.591 (15.00)
0.027 (0.686)
0.037 (0.940)
0.105 (2.67)
0.095 (2.41)
PIN 1
PIN 2
K - HEATSINK
0.205 (5.20)
0.195 (4.95)
0.055 (1.40)
0.047 (1.19)
0-0.01 (0-0.254)
0.110 (2.79)
0.090 (2.29)
0.021 (0.53)
0.014 (0.36)
0.140 (3.56)
0.110 (2.79)
Mechanical Data
Case: JEDEC TO-220AC, ITO-220AC & TO-263AB molded
plastic body
Terminals: Plated leads, solderable per
MIL-STD-750, Method 2026
Polarity: As marked
Mounting Position: Any
Mounting Torque: 10 in-lbs maximum
Weight: 0.08 oz., 2.24 g
0.405 (10.27)
0.383 (9.72)
0.140 (3.56)
0.130 (3.30) ^DIA.
0.600 (15.5)
0.580 (14.5)
PIN
1
2
0.676 (17.2)
0.646 (16.4)
0.350 (8.89)
0.330 (8.38)
0.191 (4.85)
0.171 (4.35)
0.560 (14.22)
0.530 (13.46)
0.205 (5.20)
0.195 (4.95)
0.060 (1.52)
PIN 1
PIN 2
0.037 (0.94)
0.027 (0.69)
0.188 (4.77)
0.172 (4.36)
0.110 (2.80)
0.100 (2.54)
0.131 (3.39)
DIA.
0.122 (3.08)
0.110 (2.80)
0.100 (2.54)
0.022 (0.55)
0.014 (0.36)
Mounting Pad Layout TO-263AB
0.42
(10.66)
0.63
(17.02)
0.33
(8.38)
Dimensions in inches
and (millimeters)
0.08
(2.032)
0.24
(6.096)
0.12
(3.05)
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94 V-0
• Metal silicon junction, majority carrier conduction
• Low forward voltage drop, low power loss
and high efficiency
• Guardring for overvoltage protection
• For use in low voltage, high frequency inverters, free
wheeling, and polarity protection applications
• High temperature soldering guaranteed:
250 °C/10 seconds, 0.25" (6.35 mm) from case
• Rated for reverse surge and ESD
• 175 °C maximum operation junction temperature
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