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IRFR9024TRR Datasheet, PDF (1/7 Pages) Kersemi Electronic Co., Ltd. – Power MOSFET
IRFR9024, IRFU9024, SiHFR9024, SiHFU9024
Power MOSFET
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
Qg (Max.) (nC)
Qgs (nC)
Qgd (nC)
Configuration
- 60
VGS = - 10 V
19
5.4
11
Single
0.28
S
DPAK
IPAK
(TO-252)
(TO-251)
G
D
P-Channel MOSFET
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Surface Mount (IRFR9024/SiHFR9024)
• Straight Lead (IRFU9024/SiHFU9024)
• Available in Tape and Reel
• P-Channel
• Fast Switching
• Lead (Pb)-free Available
Available
RoHS*
COMPLIANT
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effictiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surcace mount applications.
ORDERING INFORMATION
Package
DPAK (TO-252)
Lead (Pb)-free
IRFR9024PbF
SiHFR9024-E3
SnPb
IRFR9024
SiHFR9024
Note
a. See device orientation.
DPAK (TO-252)
IRFR9024TRPbFa
SiHFR9024T-E3a
IRFR9024TRa
SiHFR9024Ta
DPAK (TO-252)
IRFR9024TRLPbFa
SiHFR9024TL-E3a
IRFR9024TRLa
SiHFR9024TLa
DPAK (TO-252)
IRFR9024TRRPbFa
SiHFR9024TR-E3a
-
-
IPAK (TO-251)
IRFU9024PbF
SiHFU9024-E3
IRFU9024
SiHFU9024
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Currenta
Linear Derating Factor
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
VDS
VGS
VGS at - 10 V
TC = 25 °C
TC = 100 °C
ID
IDM
TC = 25 °C
TA = 25 °C
EAS
IAR
EAR
PD
dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
for 10 s
TJ, Tstg
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 25 V, starting TJ = 25 °C, L = 4.5 mH, RG = 25 Ω, IAS = - 8.8 A (see fig. 12).
c. ISD ≤ - 11 A, dI/dt ≤ 140 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
LIMIT
- 60
± 20
- 8.8
- 5.6
- 35
0.33
0.020
300
- 8.8
5.0
42
2.5
- 4.5
- 55 to + 150
260d
UNIT
V
A
W/°C
mJ
A
mJ
W
V/ns
°C
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