IRFL1006N Datasheet, PDF (1/9 Pages) Kersemi Electronic Co., Ltd. – Advanced Process Technology

l Surface Mount
l Advanced Process Technology
l Dynamic dv/dt Rating
l Fast Switching
l Fully Avalanche Rated
IRFL1006
S O T -2 2 3
Description
The SOT-223 package is designed for surface-mount
using vapor phase, infra red, or wave soldering techniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
G
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
Power MOSFET
D
V_DSS = 60V
R_DS(on) = 0.22Ω
I_D = 1.6A
S
Absolute Maximum Ratings
Parameter
I_D @ T_A = 25°C
I_D @ T_A = 25°C
I_D @ T_A = 70°C
I_DM
P_D @T_A = 25°C
P_D @T_A = 25°C
Continuous Drain Current, V_GS @ 10V**
Continuous Drain Current, V_GS @ 10V*
Continuous Drain Current, V_GS @ 10V*
Pulsed Drain Current 
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
V_GS
E_AS
I_AR
E_AR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy*
Peak Diode Recovery dv/dt ƒ
T_J, T_STG
Junction and Storage Temperature Range
Thermal Resistance
Parameter
R_θJA
R_θJA
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
Max.
2.3
1.6
1.3
6.4
2.1
1.0
8.3
± 20
54
1.6
0.1
5.0
-55 to + 150
Typ.
90
50
Max.
120
60
Units
A
W
W
mW/°C
V
mJ
A
mJ
V/ns
°C
Units
°C/W
2014-8-9
1
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