IRF9Z34NL Datasheet, PDF (1/10 Pages) Kersemi Electronic Co., Ltd. – Advanced Process Technology

IRF9Z34NL
l Advanced Process Technology
l Surface Mount (IRF9Z34NS)
l Low-profile through-hole (IRF9Z34NL)
l 175°C Operating Temperature
l Fast Switching
l P-Channel
l Fully Avalanche Rated
TO-262
Description
The D²Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D²Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
G
up to 2.0W in a typical surface mount application.
The through-hole version (IRF9Z34NL) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter
I_D @ T_C = 25°C
I_D @ T_C = 100°C
I_DM
P_D @T_A = 25°C
P_D @T_C = 25°C
Continuous Drain Current, V_GS @ -10V…
Continuous Drain Current, V_GS @ -10V…
Pulsed Drain Current …
Power Dissipation
Power Dissipation
Linear Derating Factor
V_GS
E_AS
I_AR
E_AR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚…
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt ƒ…
T_J
T_STG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Thermal Resistance
Parameter
RθJC
Junction-to-Case
R_θJA
Junction-to-Ambient ( PCB Mounted,steady-state)**
2014-8-30
1
D
V_DSS = -55V
R_DS(on) = 0.10Ω
I_D = -19A
S
Max.
-19
-14
-68
3.8
68
0.45
± 20
180
-10
6.8
-5.0
-55 to + 175
300 (1.6mm from case )
Units
A
W
W
W/°C
V
mJ
A
mJ
V/ns
°C
Typ.
–––
–––
Max.
2.2
40
Units
°C/W
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