R46KR410000M1M Datasheet, PDF (8/13 Pages) Kemet Corporation – Metallized Polypropylene Film EMI Suppression Capacitors

Metallized Polypropylene Film EMI Suppression Capacitors
R46 Series, Class X2, 275 VAC, 110ºC
Soldering Process cont'd
Selective Soldering Recommendations
Selective dip soldering is a variation of reflow soldering. In this method, the printed circuit board with through-hole components to be
soldered is preheated and transported over the solder bath as in normal flow soldering without touching the solder. When the board is
over the bath, it is stopped and pre-designed solder pots are lifted from the bath with molten solder only at the places of the selected
components, and pressed against the lower surface of the board to solder the components.
The temperature profile for selective soldering is similar to the double wave flow soldering outlined in this document, however, instead
of two baths, there is only one bath with a time from 3 to 10 seconds. In selective soldering, the risk of overheating is greater than
in double wave flow soldering, and great care must be taken so that the parts are not overheated.
Marking
• KEMET logo
• Series
• Capacitance
• Capacitance tolerance
• Rated voltage
• Capacitor class
• Approval marks
• Manufacturing date code
• IEC climatic category
• Passive flammability class
• Manufacturing plant
Manufacturing Date Code (IEC 60062)
Y = Year, Z = Month
Year
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
Code
M
N
P
R
S
T
U
V
W
X
A
B
C
D
E
F
H
J
K
L
M
Month
January
February
March
April
May
June
July
August
September
October
November
December
Code
1
2
3
4
5
6
7
8
9
O
N
D
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
F3093_R46_X2_275_110C • 6/27/2014 8