LDBAA2120GC5N0 Datasheet, PDF (8/12 Pages) Kemet Corporation – LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC

Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Flux/Cleaning/Storage and Moisture cont'd
Storage and moisture recommendations
KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life
(temperature ≤ 40°C/relative humidity ≤ 90%). After the MBB has been opened, components may stay in areas with controlled
temperature and humidity (temperature ≤ 30°C/relative humidity ≤ 60%) for 168 hours [MSL 3] (rated voltage ≤ 100 VDC) or 696 hours
[MSL 2a] (rated voltage > 100 VDC). For longer periods of time and/or higher temperature and/or higher relative humidity values, it
is absolutely necessary to protect the components against humidity. If the reel inside the MBB is partially used, KEMET recommends
to re-use the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not
respected, components require a baking (minimum time: 48 hours at 55 ± 5°C) before the reflow.
Manual assembly recommendations
If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the
components. Our recommendations are the following (see Fig. 1):
1. When using tweezers, the components should be gripped across the two terminations (A);
2. Avoid any contact with the two cutting surfaces (C);
3. A vacuum pen is recommended on the top and bottom surfaces (B).
Manual soldering recommendations
LDE and LDB series have been designed for Surface Mount Technology, pick & place machines and reflow soldering systems. Using a
manual soldering iron, issues may occur because the typical temperature for manual soldering is around 350°C. Therefore please pay
careful attention:
• Never touch the capacitor body with the soldering iron but rather touch the soldering iron and the end termination with the tin wire
edge (see Fig. 2);
• If the soldering iron is equipped with a temperature controller device:
Set the temperature to 250 ± 3°C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 seconds);
• If the soldering iron is NOT equipped with a temperature controller device:
This is the worst situation. The following are a few practical suggestions but, clearly, the operator’s experience is extremely important:
1. Proceed as per Fig. 2;
2. As soon as the tin wire starts melting, move the soldering iron away as quickly as possible;
3. Wait a few seconds and check that the soldering joint has been properly created;
• If the soldering iron is equipped with a hot air flow device:
Set the hot air temperature to 250 ± 3°C and do not send the hot air directly onto the capacitor plastic body. In this situation, the
operator’s experience is very important;
• In any case, avoid mass-mounting SMD Film Capacitors manually.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
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