C0402C150K5GACTU Datasheet, PDF (16/20 Pages) Kemet Corporation – Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G Dielectric, 10 – 200 VDC (Commercial Grade)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
12 and 16 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation ( _T° )
Bo
8,12
20
16 – 200
10
Typical Component Centerline
Ao
Maximum Component Rotation
Side View
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation ( _S° )
20
10
5
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
1.0 mm maximum
1.0 mm maximum
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
C1003_C0G • 6/6/2014 16