T491A335K016AT Datasheet, PDF (15/24 Pages) Kemet Corporation – Tantalum Surface Mount Capacitors – Standard Tantalum T491 Industrial Grade MnO2 Series

Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO₂ Series
Soldering Process
KEMET’s families of surface mount capacitors are compatible
with wave (single or dual), convection, IR, or vapor phase reflow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended
profile conditions for convection and IR reflow reflect the profile
conditions of the IPC/J–STD–020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three reflow passes at these conditions.
Note that although the X/7343–43 case size can withstand wave
soldering, the tall profile (4.3 mm maximum) dictates care in wave
process development.
Hand soldering should be performed with care due to the difficulty
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
and the termination, until reflow occurs. Once reflow occurs, the
iron should be removed immediately. “Wiping” the edges of a chip
and heating the top surface is not recommended.
During typical reflow operations, a slight darkening of the gold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
Profile Feature SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T_Smin)
Temperature Maximum (T_Smax)
Time (t_s) from T_smin to T_smax)
Ramp-up Rate (T_L to T_P)
Liquidous Temperature (T_L)
Time Above Liquidous (t_L)
Peak Temperature (T_P)
Time within 5°C of Maximum
Peak Temperature (t_P)
Ramp-down Rate (T_P to T_L)
Time 25°C to Peak
Temperature
100°C
150°C
60 – 120 seconds
3°C/seconds maximum
183°C
60 – 150 seconds
220°C*
235°C**
20 seconds maximum
6°C/seconds maximum
6 minutes maximum
150°C
200°C
60 – 120 seconds
3°C/seconds maximum
217°C
60 – 150 seconds
250°C*
260°C**
30 seconds maximum
6°C/seconds maximum
8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
T_P
Maximum Ramp Up Rate = 3ºC/seconds
t_P
Maximum Ramp Down Rate = 6ºC/seconds
T_L
t_L
T_smax
T_smin
t_S
25
25ºC to Peak
Time
Construction
MnO₂ /Ta₂O₅/Ta
Silver Paint
Silver Adhesive
Washer
Leadframe
(-Cathode)
Carbon
Tantalum Wire
Weld
Leadframe
(+Anode)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
T2005_T491 • 10/8/2013 15