R463N31500001M_16 Datasheet, PDF (15/17 Pages) Kemet Corporation – Metallized Polypropylene Film EMI Suppression Capacitors

Metallized Polypropylene Film EMI Suppression Capacitors
R46 Series, Class X2, 310 VAC, 110ºC
Lead Taping & Packaging (IEC 60286–2)
Figure 1
Lead Spacing 10 mm
Figure 2
Lead Spacing 15 mm
P
P₂
h
h
Figure 3
Lead Spacing 22.5 – 27.5 mm
P
ød
F P1 P0
D₀
t
P₁ P₂
Taping Specification
Description
Symbol
Lead wire diameter
d
10
Fig. 1
0.6
Dimensions (mm)
Lead Space
15
22.5
27.5
Fig. 2
Fig. 3
Fig. 3
0.6 – 0.8
0.8
0.8
Taping lead space
P
25.4
25.4
38.1
38.1
Feed hole lead space *
P₀
Centering of the lead wire
P₁
Centering of the body
P₂
Lead spacing (pitch) ***
F
12.7
12.7
12.7
12.7
7.7
5.2
7.8
5.3
12.7
12.7
19.05
19.05
10
15
22.5
27.5
Component alignment
∆h
0
0
0
0
Height of component
from tape center
H₀ ****
18.5
18.5
18.5
18.5
Carrier tape width
W
18
18
18
18
Hold down tape width
W₀
Hole position
W₁
Hold down tape position
W₂
Feed hole diameter
D₀
Tape thickness
t
9
10
10
10
9
9
9
9
3
3
3
3
4
4
4
4
0.7
0.7
0.7
0.7
* Also available in 15 mm.
** Max 1 mm on 20 lead spaces.
*** Pitches 15 mm and 10 mm taped to 7.5 mm (crimped leads) available upon request.
**** H₀ = 16.5 mm available upon request.
Tol.
±0.05
±1
±0.2 **
±0.7
±1.3
+0.6/−0.1
±2
±0.5
+1/−0.5
Minimum
±0.5
Maximum
±0.2
±0.2
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.comF3095_R46_X2_310_110C • 9/27/2016 15