C0603C470J5GAC Datasheet, PDF (11/18 Pages) Kemet Corporation – Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G Dielectric, 10 – 200 VDC (Commercial Grade)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
®
KEMET
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
178 mm (7.00")
or
330 mm (13.00")
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration – Embossed Plastic & Punched Paper (mm)
EIA Case Size
01005 – 0402
0603 – 1210
1805 – 1808
≥ 1812
KPS 1210
KPS 1812 & 2220
Array 0508 & 0612
Tape Size (W)*
8
8
12
12
12
16
8
Pitch (P₁)*
2
4
4
8
8
12
4
*Refer to Figures 1 & 2 for W and P₁ carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
C1003_C0G • 11/20/2013 11