C0603C100C5GACTU Datasheet, PDF (10/20 Pages) Kemet Corporation – Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G Dielectric, 10 – 200 VDC (Commercial Grade)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Profile Feature
Termination Finish
SnPb
100% Matte Sn
Preheat/Soak
Temperature Minimum (T_Smin)
Temperature Maximum (T_Smax)
Time (t_S) from T_Smin to T_Smax
Ramp-Up Rate (T_L to T_P)
100°C
150°C
60 – 120 seconds
3°C/second maximum
150°C
200°C
60 – 120 seconds
3°C/second maximum
Liquidous Temperature (T_L)
183°C
217°C
Time Above Liquidous (t_L)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (T_P)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (t_P)
20 seconds maximum
30 seconds maximum
Ramp-Down Rate (T_P to T_L) 6°C/second maximum 6°C/second maximum
Time 25°C to Peak
Temperature
6 minutes maximum 8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
T_P
Maximum Ramp Up Rate = 3°C/sec
t_P
Maximum Ramp Down Rate = 6°C/sec
T_L
t_L
T_smax
T_smin
t_S
25
25° C to Peak
Time
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
C1003_C0G • 6/6/2014 10