CBR06C300FAGAC Datasheet, PDF (1/1 Pages) Kemet Corporation – Ceramic, High Q, Microwave (CBR), 30 pF, 1%, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I

KEMET Part Number: CBR06C300FAGAC
Ceramic, High Q, Microwave (CBR), 30 pF, 1%, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
Dimensions
L
1.6mm +/-0.1mm
W
0.8mm +/-0.1mm
T
0.8mm +/-0.07mm
B
0.4mm +/-0.15mm
Packaging Specifications
Packaging: T&R, 180mm, Plastic Tape
Packaging Quantity: 4000
General Information
Style: SMD Chip
Series: Microwave (CBR)
Chip Size:
Description:
Features:
0603
SMD, Fixed, RF, Ultra High Q,
Low ESR, Class I
Ultra High Q, Low ESR, Class I
RoHS: Yes
Termination: Tin
Marking: No
Miscellaneous: Minimum Q = 1400
Notes: Solder Wave or Solder Reflow
Specifications
Capacitance: 30 pF
Capacitance Tolerance: 1%
Voltage DC:
Dielectric Withstanding
Voltage:
Temperature Range:
250 VDC
500 V
-55/+125C
Temperature Coefficient: C0G
Dissipation Factor: 0.1%
Aging Rate: 0% Loss/Decade Hour
Insulation Resistance: 10 GOhms
Quality Factor: 1400
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and
we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the
requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us
with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
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