C1210J685K3RACTU Datasheet, PDF (1/24 Pages) Kemet Corporation – Open Mode Design (FO-CAP), X7R Dielectric, 16- 200 VDC (Commercial & Automotive Grade)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Ceramic Open Mode capacitor in X7R dielectric
is designed to significantly minimize the probability of a low
IR or short circuit condition when forced to failure in a board
stress flex situation, thus reducing the potential for catastrophic
failure. The Open Mode capacitor may experience a drop in
capacitance; however, a short is unlikely because a crack
will not typically propagate across counter electrodes within
the device’s “active area.” Since there will not be any current
leakage associated with a typical Open Mode flex crack,
there is no localized heating and therefore little chance for a
catastrophic and potentially costly failure event.
environmental and handling conditions, it does provide superior flex
performance over standard termination systems. When combined
with flexible termination technology these devices offer the ultimate
level of protection against a low IR or short circuit condition. Open
Mode devices compliment KEMET's Floating Electrode (FE-CAP)
and Floating Electrode with Flexible Termination (FF-CAP) product
lines by providing a fail-safe design optimized for mid to high range
capacitance values. These devices exhibit a predictable change in
capacitance with respect to time and voltage and boast a minimal
change in capacitance with reference to ambient temperature.
Capacitance change is limited to ±15% from −55°C to +125°C.
Driven by the demand for a more robust and reliable
component, the Open Mode capacitor was designed for
critical applications where higher operating temperatures and
mechanical stress are a concern. These capacitors are widely
used in automotive circuits as well as power supplies (input and
output filters) and general electronic applications.
Concerned with flex cracks resulting from excessive tensile
and shear stresses produced during board flexure and thermal
cycling? These devices are available with KEMET's Flexible
termination technology which inhibits the transfer of board
stress to the rigid ceramic body, therefore mitigating flex cracks
which can result in low IR or short circuit failures. Although
flexible termination technology does not eliminate the potential
for mechanical damage that may propagate during extreme
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Ordering Information
C 1210
J
685
K
3
Ceramic
Case Size
(L" x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance Rated Voltage
Tolerance
(VDC)
0805 F = Open Mode Two significant K = ±10%
1206 J = Open Mode digits + number M = ±20%
1210 with Flexible
of zeros
1812 Termination
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
1 _{Additional termination finish options may be available. Contact KEMET for details.}
1 _{SnPb termination finish option is not available on automotive grade product.}
R
Dielectric
R = X7R
A
C
Failure Rate/ Termination
Design
Finish¹
A = N/A
C = 100%
Matte Sn
L = SnPb
(5% Pb
minimum)
TU
Packaging/Grade
(C-Spec)
See "Packaging
C-Spec
Ordering
Options Table"
below
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com C1012_X7R_OPENMODE_SMD • 2/29/2016 1