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C0805L475K9PAC Datasheet, PDF (1/3 Pages) Kemet Corporation – Surface Mount Ceramic Chip Capacitors - Low Profile Series - X5R Dielectric
Product Bulletin
Fail-Safe Floating Electrode MLCC / FE-CAP / X7R Dielectric
Outline Drawing
W
L
T
S
TIN PLATE
B
ELECTRODES
NICKEL PLATE
CONDUCTIVE METALLIZATION
Product Description
The FE-CAP is a SMD MLCC utilizing a floating internal electrode design, wherein the electrodes are con-
figured to form multiple capacitors in series within a single MLCC package. This not only yields improved
voltage and ESD performance over standard designs, but also mitigates the risk of low-IR or short-circuit
failures that can occur due to board flex. Combined with the stability of an X7R dielectric, the FE-CAP com-
plements KEMET's Open Mode Devices by providing a fail-safe design optimized for low to mid range
capacitance values.
FE-CAP Internal Design
Flex Crack
Unique electrode
design allows for
a fail-open during
a flex condition.
Dimensions – Millimeters (Inches)
EIA Size Metric Size
Code
Code
L
Length
W
Width
B
Bandwidth
S
Separation
0402
1005
1.0 (.04) ± 0.05 (.002) 0.5 (.02) ± 0.05 (.002) 0.20 (.008) -0.40 (.016) 0.30 (.012)
0603
1608 1.6 (.063) ± 0.15 (.006) 0.8 (.032) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028)
0805
2012 2.0 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.05 (.02) ± 0.25 (.010) 0.75 (.030)
1206
3216 3.2 (.126) ± 0.20 (.008) 1.6 (.063) ± 0.20 (.008) 0.50 (.02) ± .25 (.010)
N/A
1210
3225 3.2 (.126) ± 0.20 (.008) 2.5 (.098) ± 0.20 (.008) 0.50 (.02) ± .25 (.010)
N/A
1812
4532 4.5 (.177) ± 0.30 (.012) 3.2 (.126 ) ± 0.30 (.012) 0.60 (.024) ± .35 (.014)
N/A
Refer to standard thickness dimensions and table located in the F3102 SMT catalog on pages 73, 74, and 77.
F3280A 3/07