C0603C560J5GACTU Datasheet, PDF (1/9 Pages) Kemet Corporation – CERAMIC CHIP CAPACITORS

CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
W
L
T
S
TIN PLATE
B
NICKEL PLATE
ELECTRODES ^CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA
S^EIZ^IAE^SC^IZO^EDE
METRIC
S_M(IRZEeEfTCo_RnOIlDyC)E
CODE
SIZE CODE
0402*
1005
00260013**
0166038
0₀4₈0₀2₅*_*
0₁6₂0₀3_6*
0₁8₂0₁5₀*_*
12₁0₈6₁₂*
1210*
1825*
1812
2220
1825*
2²2²2²0⁵
1₂0₀0₁5₂
1₃6₂0₁8₆
2₃0₂1₂2₅
3₄2₅1₃6₂
3225
4564
4532
4⁵5⁶6⁵4⁰
5⁵6⁶5⁶0⁴
2225
5664
L - LENGTH
0.6 (.024) ± .03 (.001)
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
W - WIDTH
0.3 ± (.012) ± .03 (.001)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
T
THICKNESS
See page 78
for thickness
dimensions.
B - BANDWIDTH
0.15 (.006) ± .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
S
SEPARATION
minimum
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
or
Solder Wave +
or
Solder Reflow
Solder
Reflow
Solder Reflow
CAPACITOR ORDERING INFORMATION ^{(Standard Chips - For}
C 0805 C 103 K 5 R A C*
Military see page 87)
CERAMIC
END METALLIZATION
SIZE CODE
C-Standard (Tin-plated nickel barrier)
SPECIFICATION
C - Standard
FAILURE RATE LEVEL
CAPACITANCE CODE
A- Not Applicable
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF M – ±20%
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
F – ±1%
P – (GMV) – special order only
1 - 100V 3 - 25V
G – ±2%
Z – +80%, -20%
2 - 200V 4 - 16V
5 - 50V
8 - 10V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces) _{7 - 4V}
9 - 6.3V
72
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, [phone]