C0402C152J5GACTU Datasheet, PDF (1/6 Pages) Kemet Corporation – Surface Mount Ceramic Chip Capacitors – Ultra-High Capacitance, C0G Dielectric

Product Bulletin
Surface Mount Ceramic Chip Capacitors –
Ultra-High Capacitance, C0G Dielectric
Outline Drawing
W
T
L
B
TIN PLATE
S
NICKEL PLATE
ELECTRODES
CONDUCTIVE METALLIZATION
Dimensions - Millimeters (Inches)
EIA SIZE METRIC
CODE SIZE CODE
L - LENGTH
W - WIDTH
B - BANDWIDTH
S
SEPARATION
minimum
MOUNTING
TECHNIQUE
0402
0603
0805
1206
1210
1005
1608
2012
3216
3225
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
Solder Reflow
Solder Wave +
or
Solder Reflow
See Capacitance Value Chart below for thickness dimension.
+ For extended values 1210 case sizes - solder reflow only. (Refer to F3102 catalog for additional soldering information and recommendations.)
Ordering Information
C 0805 C 103 K
Style
C - Ceramic
Size Code
0402, 0603, 0805, 1206, 1210
Specification
C - Standard
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
(Use “8” for 0.1 through .99 pF)
Capacitance Tolerance
F = ±1%
K = ±10%
G = ±2% M = ±20%
J = ±5%
5 G AC
End Metallization
C = Standard (Tin-plate
nickel barrier)
Failure Rate Level
A = Not Applicable
Temperature Characteristic
Designated by Capacitance
Change Over Temperature Range
G = C0G (NP0) (±30 PPM/°C)
8 = 10V
4 = 16V
3 = 25V
Voltage
5 = 50V
1 = 100V
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com F9200 11/07