GN1G Datasheet, PDF (1/2 Pages) KEC(Korea Electronics) – Surface Mount Glass Passivated Rectifier

SEMICONDUCTOR
TECHNICAL DATA
FEATURES
Plastic package has Underwriters Laboratory flammability
Classification 94V-0.
For surface mounted aplications.
Low profile package.
Built-in strain relief, ideal for automated placement.
Glass passivated chip junction.
High temperature soldering guaranteed
: 250 /10 seconds at terminals.
MAXIMUM RATING (Ta=25 )
CHARACTERISTIC
SYMBOL
Repetitive peak reverse voltage
RMS voltage
DC blocking voltage
Average forward rectified current
(see fig.1)
Peak forward surge current 8.3ms single
half sine-wave superimposed on rated
load (JEDEC Method) T_L=110
Operating Junction and
Storage Temperature Range
V_RRM
V_RMS
V_DC
I_F(AV)
I_FSM
Tj, Tstg
RATING
400
280
400
1
40
-55~150
UNIT
V
V
V
A
A
GN1G
Surface Mount Glass Passivated Rectifier
B
2
1
C
G
DIM
A
B
C
D
E
F
G
Unit : mm
MILLIMETERS
4.3 +_ 0.3
2.525 +_ 0.12
1.45 +_ 0.18
5.0 +_ 0.2
1.15 +_ 0.35
2.075 +_ 0.175
0.23+_ 0.08
1. ANODE
2. CATHODE
SMA(1)
Marking
Cathode Mark
Type Name
E140
Lot No.
ELECTRICAL CHARACTERISTICS (Ta=25 )
CHARACTERISTIC
SYMBOL
CONDITION
Forward voltage
V_F
I_F=1A
Leakage current
Ta=25
Ta=125
I_R
V_RRM=400V
Reverse recovery time
t_rr
I_F=0.5A, I_R=1.0A
Junction capacitance
C_J
V_R=4.0V, f=1MHz
Thermal resistance
R_th(A)
(Note1)
Junction to ambient
R_th(L) Junction to lead
Note 1) Thermal resistance from junction to ambient and from junction to lead mounted
on P.C.B with (5.0 5.0mm) copper pads.
MIN
TYP
MAX UNIT
-
-
1.1
V
-
-
1.0
A
-
-
50
-
1.8
-
S
-
12
-
pF
-
-
75
/W
-
-
27
2006. 5. 16
Revision No : 1
1/2