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SS32_14 Datasheet, PDF (1/2 Pages) Taiwan Semiconductor Company, Ltd – Surface Mount Schottky Barrier Rectifier
SS32 THRU SS3200
Surface Mount Schottky Barrier Rectifiers
Features
● Low profile package
● Ideal for automated placement
● Ultrafast reverse recovery time
● Low power losses, high efficiency
● Low forward voltage drop
● High surge capability
● High temperature soldering:
260℃/10 seconds at terminals
● Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
● Case: JEDEC DO-214AA molded plastic
body over passivated chip
● Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
● Polarity: Laser band denotes cathode end
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Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
PARAMETER
SYMBOL
Maximum repetitive peak reverse voltage
VRRM
Maximum RMS voltage
VRMS
Maximum DC blocking voltage
VDC
Maximum average forward rectified current
I(AV)
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
IFSM
Maximum instantaneous forward voltage at 3.0A
VF
Maximum DC reverse current TA=25 ℃
at rated DC blocking voltage TA=100 ℃
IR
Typical junction capacitance (NOTE 1)
CJ
Typical thermal resistance (NOTE 2)
RθJA
Operating junction temperature range
TJ
Storage temperature range
TSTG
SS32 SS 34 SS36 SS38 SS310 SS3150 SS3200
20
40
60
80
100
150
200
14
28
42
56
70
105
140
20
40
60
80
100
150
200
3.0
100
0.55
0.70
0.85
0.5
20
500.0
88.0
-65 to +125
-65 to +150
0.95
0.2
10
2
300.0
-65 to +150
UNIT
VOLTS
VOLTS
VOLTS
Amp
Amps
Volts
mA
pF
℃/W
℃
℃
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.Thermal resistance from junction to ambient at 0.375”(9.5mm)lead length,P.C.B. mounted
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