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RMB2F Datasheet, PDF (1/2 Pages) Guangdong Juxing Electronics Technology Co., Ltd. – SURFACE MOUNT BRIDGE RECTIFIERS
RMB2F-RMB6F
SURFACE MOUNT BRIDGE RECTIFIERS
Major Ratings and Characteristics
IF(AV)
VRRM
IFSM
IR
trr
VF
Tj max.
0.5A , 0.8A
200-600V
30 A
5.0 μA
150nS,250nS
1.25V
150 °C
Features
● Low profile space
● Ideal for automated placement
● Glass passivated chip junction
● Low forward voltage drop
● Low leakage current
● High forward surge capability
● High temperature soldering:
260℃/10 seconds at terminals
● Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
● Case: MBF Molded plastic
over glass passivated chip
● Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
● Polarity: Polarity symbols marked on body
Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(TA = 25 °C unless otherwise noted)
Symbol RMB2F
RMB4F
RMB6F
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward output rectified
current at TA=30℃
-on glass-epoxy P.C.B (NOTE 1)
-on aluminum substrate (NOTE 2)
VRRM
200
400
600
VRMS
140
280
420
VDC
200
400
600
IF(AV)
0.5
0.8
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load(JEDEC Method)
IFSM
30
Maximum instantaneous forward voltage drop per leg at 0.4A
VF
Maximum DC reverse current at
rated DC blocking voltage per leg
TA = 25 ℃
TA = 125℃
IR
1.25
5.0
100
Maximum reverse recovery time
at IF = 0.5 A , IR = 1.0 A , Irr = 0.25 A
trr
150
250
Typical junction capacitance per leg at 4.0 V ,1MHz
CJ
13
Thermal resistance per leg
(NOTE 1)
RθJA
85
(NOTE 2)
RθJA
70
(NOTE 1)
RθJL
20
Operating junction and storage temperature range
TJ, TSTG
–55 to +150
NOTE1:On glass epoxy P.C.B. mounted on 0.05×0.05″(1.3×1.3mm) pads
NOTE2:On aluminum substrate P.C.B. with an area of 0.8×0.8″(20×20mm) mounted on 0.05×0.05″(1.3×1.3mm) solder pad
UNIT
V
V
V
A
A
V
μA
nS
pF
℃/ W
℃
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