MB05S_17 Datasheet, PDF (1/2 Pages) Guangdong Juxing Electronics Technology Co., Ltd. – SURFACE MOUNT BRIDGE RECTIFIERS

MB05S – MB10S
SURFACE MOUNT BRIDGE RECTIFIERS
Features
! Glass Passivated Die Construction
! Low Forward Voltage Drop
! High Current Capability
! High Surge Current Capability
! Designed for Surface Mount Application
B
! Plastic Material – UL Flammability 94V-O





















































C
-
+
~
~
A
Mechanical Data
! Case: MB-S, Molded Plastic
! Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
! Polarity: As Marked on Case
! Weight: 0.22 grams (approx.)
! Mounting Position: Any
! Marking: Type Number
! Lead Free: For RoHS / Lead Free Version,
H
G
FE
D
J
L
K
MB-S
MB-S
Dim Min Max
A 4.50 4.95
B 3.60 4.10
C 0.60 0.80
D 0.15 0.35
E 6.40 7.00
—
0.20
G 0.50 1.10
H 1.30 1.70
J 2.30 2.70
K 2.30 2.70
L
—
3.00
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Ratings at 25 ambient temperature unless otherwise specified.
Single phase, half wave, 60H_Z, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (Note 1) @T_A = 40°C
Average Rectified Output Current (Note 2) @T_A = 40°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I²t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
@I_F = 0.5A
Peak Reverse Current
At Rated DC Blocking Voltage
@T_A = 25°C
@T_A = 125°C
Typical Junction Capacitance per leg (Note 3)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
Symbo MB05S MB1S MB2S MB4S MB6S MB10S Unit
VRRM
VRWM
VR
100
200
400
600
800 1000
V
VR(RMS)
70
140
280
420
560
700
V
IO
0.5
0.8
A
IFSM
30
A
I²t
VFM
IRM
Cj
R
JA
R
JL
Tj, TSTG
5.0
1.0
5.0
500
13
70
20
-55 to +150
A²s
V
µA
pF
°C/W
°C
Note: 1. Mounted on glass epoxy PC board with 1.3mm² solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm² solder pad.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
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