MB05F_GW Datasheet, PDF (1/2 Pages) Guangdong Juxing Electronics Technology Co., Ltd. – SURFACE MOUNT BRIDGE RECTIFIERS

MB05F(GW) – MB10F(GW)
SURFACE MOUNT BRIDGE RECTIFIERS
Features
! Glass Passivated Die Construction
! Low Forward Voltage Drop
! High Current Capability
! High Surge Current Capability
! Designed for Surface Mount Application
B
! Plastic Material – UL Flammability 94V-O





















































Mechanical Data
J
! Case: MBF(GW), Molded Plastic
! Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
! Polarity: As Marked on Case
! Weight: 0.134 grams (approx.)
! Mounting Position: Any
! Marking: Type Number
! Lead Free: For RoHS / Lead Free Version,
G
-
+
~
~
A
K
H
C
DE
L
MBF(GW)
Dim
Min
Max
A
4.50
4.95
B
3.60
4.10
C
0.15
0.35
D
—
0.20
E
6.40
7.00
G
0.50
1.10
H
1.30
1.70
J
1.20
1.60
K
2.30
2.70
L
—
1.80
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @T_A=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (Note 1) @T_A = 40°C
Average Rectified Output Current (Note 2) @T_A = 40°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I²t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
@I_F = 0.5A
Peak Reverse Current
At Rated DC Blocking Voltage
@T_A = 25°C
@T_A = 125°C
Typical Junction Capacitance per leg (Note 3)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
Symbo MB05F MB1F MB2F MB4F MB6F MB8F MB10F Unit
VRRM
VRWM
50
100
200
400
600 800
1000
V
VR
VR(RMS)
35
70
140
280
420 560
700
V
IO
0.5
0.8
A
IFSM
30
A
I² t
VFM
IRM
Cj
R
JA
R
JL
Tj, TSTG
5.0
1.0
5.0
500
13
60
16
-55 to +150
A ²s
V
µA
pF
°C/W
°C
Note: 1. Mounted on glass epoxy PC board with 1.3mm² solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm² solder pad.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0 volts.
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