L-07C4N7SV6T Datasheet, PDF (5/5 Pages) Johanson Technology Inc. – RF CERAMIC CHIP INDUCTORS

RF CHARACTERISTICS CHARACTERISTICS (TYPICAL)
INDUCTANCE VS FREQUENCY: SIZE 0402
500
100
47N
27N
15N
10 _6N8
3N3
1N5
1.0
0.01
0.1
1.0
10
FFrereqquueencyy ((GGHHzz))
INDUCTANCE VS FREQUENCY: SIZE 0603
1000
100 ^R10
56N
27N
12N
10
4N7
2N2
1.0
0.01
0.1
1.0
10
FFrereqquueenccyy ((GGHHzz))
INDUCTANCE VS FREQUENCY: SIZE 0805
1000
100
80
60
40
20
0
0.01
100
80
60
40
20
0
0.01
150
R15
100 ^R10
56N
27N
12N
10
4N7
2N2
1.0
0.01
0.1
1.0
FFrereqquuenccyy ((GGHHzz) )
100
50
0
10
0.01
Q VS FREQUENCY: SIZE 0402
1N5
3N3
6N8
15N
27N
47N
0.1
1.0
10
F^Fre^req^qu^ue^enⁿc^cyy ⁽(^GG^HH^zz⁾)
Q VS FREQUENCY: SIZE 0603
2N2
4N7
12N
27N
56N
R10
0.1
1.0
10
F^Fre^req^qu^ue^enⁿc^cyy ⁽(^GG^HH^zz⁾)
Q VS FREQUENCY: SIZE 0805
2N2
4N7
12N
27N
56N
R10
R15
0.1
1.0
10
F^Fre^req^qu^ue^enⁿc^cy^{y (}(^GG^HH^zz⁾)
MECHANICAL & ENVIRONMENTAL CHARACTERISTICS
SOLDERABILITY:
RESISTANCE TO SOLDERING:
THERMAL SHOCK:
LIFE TEST:
HUMIDITY RESISTANCE:
SPECIFICATION
Solder coverage ≥ 75% of electrodes L=±10% Q=± 20%
No apparent damage Solder coverage ≥ 75% L=±10% Q=± 20%
No apparent damage L=±10% Q=± 20%
No apparent damage L=±10% Q=± 20%
Inductance change: 2% or .5pF Max
TERMINAL ADHESION:
PCB DEFLECTION:
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
TEST PARAMETERS
Preheat 120±20°C for 1 min. Dip 230±10°C for 3±1 sec.
Preheat 120±20°C for 1 min. Dip 260±10°C for 10±1 sec.
100 cycles: 30±3 minutes @ +100°C then 30±3 min. @ -40°C
1000 ±48 Hours @ +85±2°C, rated current (1-2 hour recovery)
1000 ±48 Hours @ +40±2°C, 90-95% relative humidity,
rated current (1-2 hour recovery)
Lateral pull force: 0201 ≥1.0Lbs 0402 ≥1.6Lbs
For 0603 ≥ 2.2Lbs For 0805 ≥4.4Lbs
Glass Epoxy PCB: 1 mm deflection
20
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