500R07S0R2AV4T Datasheet, PDF (2/3 Pages) Johanson Technology Inc. – APPLICATION NOTES FOR CERAMIC CHIP CAPACITORS

APPLICATION NOTES FOR CERAMIC CHIP CAPACITORS
SOLDER WAVE
Wave soldering is perhaps the most rigorous of surface
mount soldering processes due to the steep rise in
temperature seen by the circuit as it is immersed in the
molten solder wave, typically at 240°C. Recommended
temperature limits for wave soldering are shown in Fig. 4.
COOL DOWN CYCLE
After the solder reflows properly the assembly should be
allowed to cool gradually at room ambient conditions.
Attempts to speed this cooling process or immediate
exposure of the circuit to cold cleaning solutions
may result in thermal shock cracking of the ceramic
capacitor.
240
210
Soak: 160 ± 5°C
60 Sec. Min.
180
Soldering Time
25 Sec. Max. @230°C
150
120
90
Pre-heat:
1.0 to 2.0 °C/sec.
60
Gradual Cooling at
Room Temperature
30
0
25 50 75 100 125 150 175 200 225 250 275
Time (sec.)
Figure 1: Solder Reflow Profile for LASERtrims®
280
260
240
220
200
Pre-heating Zone:
1.0 to 2.0 °C/sec. Max
160
120
80
40
Soldering Time
20 Sec. Max. @ 260°C
Gradual Cooling at
Room Temperature
0
20 40 60 80 100 120 140 160 180 200 220
Time (sec.)
Figure 2: Solder Reflow Profile for MLCCs
280
Soldering Time
240
40 Sec. Max. @ 215°C
215
200
Pre-heating Zone:
1.0 to 2.0 °C/sec. Max
160
Gradual Cooling at
Room Temperature
120
80
40
0
20 40 60 80 100 120 140 160 180 200 220
Time (sec.)
Figure 3: Vapor Phase Profile for MLCCs
280
260
240
220
200
Pre-heat @
1.0 to 2.0 °C/sec. Max
160
120
80
40
Soldering Time
5 Sec. Max. @260°C
Gradual Cooling at
Room Temperature
0
20 40 60 80 100 120 140 160 180 200 220
Time (sec.)
Figure 4: Wave Solder Profile for MLCCs
Please refer to our web site for solder profile information for other component types.
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