English
Language : 

2450DP15K5400 Datasheet, PDF (1/2 Pages) Johanson Technology Inc. – High Frequency Ceramic Solutions
"High Frequency Ceramic Solutions"
2.45 / 5.4GHz Ceramic Chip Diplexer (LPF/BPF type)
Detail Specification: 12/15/2011
P/N 2450DP15K5400
Page 1 of 2
General Specifications
Part Number
2450DP15K5400
Passband Insertion
(MHz)
Loss (dB)
Attenuation
Return Isolation
Loss (dB) (dB)
Impedance
Oper. Temp
50 Ω
-40 to +85°C
2400~2500
4900~5950
0.5 max. 20dB min. (27 typ.) @4.8-6.0GHz
(0.25 typ.) 20dB min. (30 typ.) @7.2-7.5GHz
0.65 max. 20dB min. (23 typ.) @ 0.8-2.5GHz
(0.35 typ.) 15dB min. (18typ.) @9.8-11.9GHz
10 min.
(20 typ.)
10 min.
(15 typ.)
20 min. (22
typ.) @DC-
2.5GHz
20 min. (27
typ.) @4.9-
5.95GHz
Storage Temp
+5 to +35°C, Humidity
45~75%RH, 18 mos max*
Input Power
Reel Quanity
2W max
4000
*18 months in vacuum sealed bag and 1 week after opened. Go
to: www.johansontechnology.com/silverleads for details
Packaging
Style
Termination
Style
Bulk Suffix = S
Eg. 2450DP15K5400S
T & R Suffix = E
Eg. 2450DP15K5400E
AgPt Suffix = None Eg. 2450DP15K5400(E or S)
Tin / Lead Please consult Factory
Mechanical Dimensions
In
mm
L 0.079 ± 0.004 2.00 ± 0.10
W 0.049 ± 0.004 1.25 ± 0.10
T 0.020 ± 0.004 0.50 ± 0.10
a 0.012 ± 0.004 0.30 ± 0.10
b 0.008 ± 0.004 0.20 ± 0.10
c 0.012 +.004/-.008 0.30 +0.1/-0.2
g 0.014 ± 0.004 0.35 ± 0.10
p 0.026 ± 0.002 0.65 ± 0.05
L
Units : mm
c
cW
a
g
p
T
b
Terminal Configuration
No. Function
1
GND
2
Common Port
3
GND
4 Lower Freq. Port
5
GND
6 Higher Freq. Port
6
5
4
1
2
3
Mounting Considerations
*Line width should be designed to provide 50 Ω
impedance matching characteristics.
Units: mm
1.65
Evalboard
P/N:2450DP15K5400 -EBSMA
2.80
1
6
*
2
3
4
5
*
0.35
0.30
* 1.00
0.80
Solder Resist
Land
Through-hole ( φ
0.35/0.20)
Johanson Technology, Inc. reserves the right to make design changes without notice.
All sales are subject to Johanson Technology, Inc. terms and conditions.
www.johansontechnology.com
4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821
2011 Johanson Technology, Inc. All Rights Reserved