2450BM15A0002E Datasheet, PDF (1/2 Pages) Johanson Technology Inc. – High Frequency Ceramic Solutions

High Frequency Ceramic Solutions
2.45 GHz Impedance Matched Balun-BPF: For TI CC253X, CC254X, CC257X,
CC853X and CC852X Chipset family
Detail Specification: 4/29/2013
P/N 2450BM15A0002
Page 1 of 2
General Specifications
Part Number
2450BM15A0002
Frequency (MHz)
2400 - 2500
Unbalanced Impedance
50 Ω
Balanced Differential
Impedance
Impedance match to T.I. CC253X,
CC254X, CC257X, CC853X and CC852X
Chipsets
Insertion Loss
1.5 dB max. (-40°C to +85°C)
Insertion Loss
1.7 dB max. (-40°C to +125°C)
Return Loss (-40°C to 125°C)
9.5 dB min.
Differential Mode
Attenuation (dB)
-40°C to 125°C
Phase Diff. (-40°C to 125°C)
Input Power
Reel Quanity
Operating Temperature
Recommended Storage
Conditions
12 min. @ 1GHz
18 min. @ 4800~5000MHz
20 min. @ 7200~7500MHz
180° ± 15
2W max.
4,000
-40°C to +125°C
+5 ~ +35 °C, Humidity
45~75%RH, 18 mos. max
Part Number Explanation
Packaging ^Bulk
P/N ^Style
T&R
Suffix Termination Style _{100% Tin}
Evaluation Board
Suffix = S
Eg. 2450BM15A0002S
Suffix = E
Eg. 2450BM15A0002E
Suffix = None Eg. 2450BM15A0002(E or S)
2450BM15A0002-EBSMA
Mechanical Dimensions
In
mm
L 0.079 ± 0.004 2.00 ± 0.10
W 0.049 ± 0.004 1.25 ± 0.10
T 0.028 ± 0.004 0.70 ± 0.10
a 0.012 ± 0.004 0.30 ± 0.10
b 0.008 ± 0.004 0.20 ± 0.10
c 0.012 +.004/-.008 0.30 +0.1/-0.2
g 0.014 ± 0.004 0.35 ± 0.10
p 0.026 ± 0.002 0.65 ± 0.05
W
L
c
a
p
T
g
b
Terminal Configuration
No.
Function
1 Unbalanced Port
2
GND
3
Balanced Port
4
Balanced Port
5
GND
6
GND



 
Mounting Considerations
Mount these devices with brown mark facing up. Units: mm
* Line width should be designed to provide 50 Ω impedance matching characteristics.
0.35
Solder Resist
Land
Through-hole (0.3)
T.I. Chipset
0.8
 
 
Note: No DC
Blocking Capacitor
*
required (internal)
1.0
0.30
Johanson Technology, Inc. reserves the right to make design changes without notice.
All sales are subject to Johanson Technology, Inc. terms and conditions.
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