P0220A Datasheet, PDF (3/4 Pages) JIEJIE MICROELECTRONICS CO.,Ltd – Excellent capability of absorbing transient surge

P0220A/P0300A
JieJie Microelectronics CO. , Ltd
SOLDERING PARAMETERS
Reflow Condition
-Temperature Min (T_s(min))
Pre Heat
-Temperature Max(T_s(max))
-Time (Min to Max) (ts)
Average ramp up rate (Liquid us Temp (T_L) to peak)
T_s(max) to T_L - Ramp-up Rate
Reflow
-Temperature(T_L) (Liquid us)
-Temperature(t_L)
Peak Temp (T_p)
Time within 5℃ of actual Peak Temp (t_p)
Ramp-down Rate
Time 25℃ to Peak Temp (T_P)
Do not exceed
Pb-Free assembly
(see FIG.2)
+150℃
+200℃
60-180 secs.
3℃/sec. Max
3℃/sec. Max
+217℃
60-150 secs.
+260(+0/-5)℃
8-15 secs.
6℃/sec. Max
8 min. Max
+260℃
FIG.1: tr × td pulse waveform
%IPP
100 Peak value
tr = rise time to peak value
td = decay time to half value
50
Half value
FIG.2: Reflow condition
TP
TL
TS(max)
TS(min)
Ramp-up
Preheat
ts
tp
Critical Zone
TL to TP
tL
Ramp-down
t(μs)
0
0 ^tr
td
FIG.3: Normalized Vs change vs. junction
temperature
Percent of Vs change(%)
12
8
4
25℃
0
-4
Tj(℃)
-8
-40 -20 0 20 40 60 80 100 120 140 160
25
time to peak temperatue
(t 25℃ to peak)
Time
FIG.4: Normalized DC holding current vs. case
temperature
IH(Tj)/IH(Tj=25℃)
2.0
1.8
1.6
1.4
1.2
25℃
1.0
0.8
0.6
TC (℃)
0.4
-40 -20 0 20 40 60 80 100 120 140 160
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