CPC44055ST Datasheet, PDF (3/8 Pages) IXYS Corporation – AC Power Switch

INTEGRATED CIRCUITS DIVISION
2 Thermal Characteristics
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
Conditions
-
Free Air
-
Symbol
_JC
_JA
T_J
Rating
0.35
27
-40 to +100
2.1 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
θ_CA =
(T_J - T_A)
P_D
-
θ_JC
CPC44055ST
Units
°C/W
°C/W
°C
T_J = Junction Temperature (°C), T_J ≤ 150°C *
T_A = Ambient Temperature (°C)
θ_JC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θ_CA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P_D = On-State Voltage (V_rms) • Load Current (A_rms)
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
2.2 Thermal Performance Data
Output Power Dissipation
vs. Load Current
40
Output Power Dissipation
vs. Ambient Temperature
40
35
35
30
Heat Sink
30
2ºC/W
25
5ºC/W
25
10ºC/W
20
15ºC/W
20
15
15
10
10
5
5
No Heat Sink
0
0
0
5
10 15 20 25 30 0 10 20 30 40 50 60 70 80 90
Load Current (A_rms)
Ambient Temperature (ºC)
3
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