MCC200 Datasheet, PDF (1/3 Pages) IXYS Corporation – Thyristor Modules

Thyristor Modules
MCC 200
MCD 200
I_TRMS = 2x340 A
I_TAVM = 2x196 A
V_RRM = 1400-1800 V
V_RSM
V_DSM
V
V_RRM
V_DRM
V
Type
1500 1400 MCC 200-14io1 MCD 200-14io1
1700 1600 MCC 200-16io1 MCD 200-16io1
1900 1800 MCC 200-18io1 MCD 200-18io1
3 67 1 542
MCC
3
MCD
1 542
3
2
1
67
54
Symbol
Conditions
Maximum Ratings
I_TRMS / I_FRMS
I_TAVM / I_FAVM
I_TSM / I_FSM
∫i²dt
(di/dt)_cr
(dv/dt)_cr
P_GM
P_GAV
V_RGM
T_VJ
T_VJM
T_stg
V_ISOL
M_d
T_VJ = T_VJM
T_C = 90°C; 180° sine
T_C = 85°C; 180° sine
T_VJ = 45°C;
V_R = 0
t = 10 ms (50 Hz), sine
t = 8.3 ms (60 Hz), sine
T_VJ = T_VJM
V_R = 0
t = 10 ms (50 Hz), sine
t = 8.3 ms (60 Hz), sine
T_VJ = 45°C;
V_R = 0
t = 10 ms (50 Hz), sine
t = 8.3 ms (60 Hz), sine
T_VJ = T_VJM;
V_R = 0
t = 10 ms (50 Hz), sine
t = 8.3 ms (60 Hz), sine
T_VJ = T_VJM;
repetitive; I_T = 500 A
f = 50Hz; t_P = 200µs;
V_D = ²/₃ V_DRM;
I_G = 0.5 A;
di_G/dt = 0.5 A/µs
non repetitive; I_T = 500 A
T_VJ = T_VJM; V_DR = ²/₃ V_DRM
R_GK = ∞; method 1 (linear voltage rise)
T_VJ = T_VJM; t_P = 30 µs
I_T = I_TAVM; t_P = 500 µs
340
196
216
8000
8600
7000
7500
320 000
311 000
245 000
236 000
100
500
1000
120
60
20
A
A
A
A
A
A
A
A²s
A²s
A²s
A²s
A/µs
A/µs
V/µs
W
W
W
10
V
-40...+125
°C
125
°C
-40...+125
°C
50/60 Hz, RMS;
I_ISOL ≤ 1 mA;
t = 1 min
t=1s
Mounting torque (M6)
Terminal connection torque (M6)
3000
V~
3600
V~
2.25-2.75/20-25 Nm/lb.in.
4.5-5.5/40-48 Nm/lb.in.
Weight
Typical including screws
125
g
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
© 2004 IXYS All rights reserved
Features
• International standard package
• Direct copper bonded Al₂O₃ -ceramic
base plate
• Planar passivated chips
• Isolation voltage 3600 V~
• UL registered, E 72873
• Keyed gate/cathode twin pins
Applications
• Motor control
• Power converter
• Heat and temperature control for
industrial furnaces and chemical
processes
• Lighting control
• Contactless switches
Advantages
• Space and weight savings
• Simple mounting
• Improved temperature and power
cycling
• Reduced protection circuits
1-3