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IXZR18N50 Datasheet, PDF (1/4 Pages) IXYS Corporation – Z-MOS RF Power MOSFET | |||
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IXZR18N50 & IXZR18N50A/B
Z-MOS RF Power MOSFET
N-Channel Enhancement Mode Switch Mode RF MOSFET
Low Capacitance Z-MOSTM MOSFET Process
Optimized for RF Operation
Ideal for Class C, D, & E Applications
VDSS
ID25
= 500 V
= 19 A
Symbol
VDSS
VDGR
VGS
VGSM
ID25
IDM
IAR
EAR
dv/dt
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 Mâ¦
Continuous
Transient
Tc = 25°C
Tc = 25°C, pulse width limited by TJM
Tc = 25°C
Tc = 25°C
IS ⤠IDM, di/dt ⤠100A/µs, VDD ⤠VDSS,
Tj ⤠150°C, RG = 0.2â¦
IS = 0
Maximum Ratings
500 V
500 V
±20 V
±30 V
19 A
95 A
19 A
TBD mJ
5 V/ns
>200 V/ns
RDS(on) ⤠0.37 â¦
PDC
= 350 W
PDC
PDHS
PDAMB
RthJC
RthJHS
Tc = 25°C, Derate 4.4W/°C above 25°C
Tc = 25°C
350 W
TBD W
3.0 W
TBD C/W
TBD C/W
Symbol Test Conditions
Characteristic Values
(TJ = 25°C unless otherwise specified)
min. typ. max.
VDSS
VGS = 0 V, ID = 4 ma
500
V
VGS(th)
VDS = VGS, ID = 250µÎ
4.6
V
IGSS
IDSS
VGS = ±20 VDC, VDS = 0
VDS = 0.8VDSS
VGS=0
=125C
TJ = 25C
TJ
±100 nA
50 µA
1 mA
RDS(on)
VGS = 20 V, ID = 0.5ID25
0.37
â¦
Pulse test, t ⤠300µS, duty cycle d ⤠2%
gfs
VDS = 50 V, ID = 0.5ID25, pulse
test
6.7
S
TJ
-55
+175 °C
TJM
175
°C
Tstg
-55
+ 175 °C
TL
1.6mm(0.063 in) from case for 10
s
300
°C
Weight
3.5
g
Features
⢠Isolated Substrate
â high isolation voltage (>2500V)
â excellent thermal transfer
â Increased temperature and power
cycling capability
⢠IXYS advanced Z-MOS process
⢠Low gate charge and capacitances
â easier to drive
â faster switching
⢠Low RDS(on)
⢠Very low insertion inductance (<2nH)
⢠No beryllium oxide (BeO) or other
hazardous materials
Advantages
⢠Optimized for RF and high speed
⢠Easy to mountâno insulators needed
⢠High power density
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