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IXZ308N120 Datasheet, PDF (1/3 Pages) IXYS Corporation – Z-MOS RF Power MOSFET | |||
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IXZ308N120
Z-MOS RF Power MOSFET
N-Channel Enhancement Mode LSiwneitcahr 1M7o5dMeHRzFRMFOMSOFSEFTET
LowCCapaapcaictaitnacneceZ-ZM-MOOSTSMTMMMOOSFSEFTETPrPorcoecsesss
Optimized for RLiFneOapr eOrapteiorantion
Ideal for Class ACB, D&, C&,EBAropapdliccaastito&nsCommunications Applications
VDSS
ID25
= 1200 V
= 8.0 A
Symbol Test Conditions
VDSS
VDGR
VGS
VGSM
ID25
IDM
IAR
EAR
dv/dt
PDC
PDHS
PDAMB
RthJC
RthJHS
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 Mâ¦
Continuous
Transient
Tc = 25°C
Tc = 25°C, pulse width limited by TJM
Tc = 25°C
Tc = 25°C
IS ⤠IDM, di/dt ⤠ï°100A/µs, VDD ⤠VDSS,
Tj ⤠150°C, RG = 0.2â¦
IS = 0
Tc = 25°C, Derate 4.4W/°C above 25°C
Tc = 25°C
VDSS
VGS(th)
IGSS
IDSS
RDS(on)
gfs
TJ
TJM
Tstg
TL
Weight
VGS = 0 V, ID = 4 ma
VDS = VGS, ID = 250µÎ
VGS = ±20 VDC, VDS = 0
VDS = 0.8VDSS
VGS=0
TJ = 25C
TJ =125C
min.
1200
3.5
VGS = 20 V, ID = 0.5ID25
Pulse test, t ⤠300µS, duty cycle d ⤠2%
VDS = 50 V, ID = 0.5ID25, pulse test
-55
-55
1.6mm(0.063 in) from case for 10 s
Maximum Rat-
ings
1200 V
1200 V
±20 V
±30 V
8A
40 A
8A
TBD mJ
5 V/ns
RDS(on) =
PDC
=
2.1 â¦
880 W
>200 V/ns
880 W
GATE
440 W
DRAIN
3.0 W
0.17 C/W
0.34 C/W
typ. max.
V
6.5
V
±100 nA
50 µA
1 mA
2.1
â¦
10.1
S
+175 °C
175
°C
+ 175 °C
SG1 SG2
SD1 SD2
Features
⢠Isolated Substrate
â high isolation voltage (>2500V)
â excellent thermal transfer
â Increased temperature and power
cycling capability
⢠IXYS advanced Z-MOS process
⢠Low gate charge and capacitances
â easier to drive
â faster switching
⢠Low RDS(on)
⢠Very low insertion inductance (<2nH)
⢠No beryllium oxide (BeO) or other
hazardous materials
Advantages
⢠Optimized for RF and high speed
⢠Easy to mountâno insulators needed
⢠High power density
300
°C
3.5
g
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