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IXYR100N120C3 Datasheet, PDF (1/6 Pages) IXYS Corporation – 1200V XPTTM IGBT
1200V XPTTM IGBT
GenX3TM
(Electrically Isolated Tab)
High-Speed IGBT
for 20-50 kHz Switching
IXYR100N120C3
Symbol
VCES
VCGR
VGES
VGEM
IC25
IC110
ICM
IA
EAS
SSOA
(RBSOA)
PC
TJ
TJM
Tstg
TL
TSOLD
VISOL
FC
Weight
Test Conditions
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGE = 1MΩ
Continuous
Transient
TC = 25°C (Chip Capability)
TC = 110°C
TC = 25°C, 1ms
TC = 25°C
TC = 25°C
VGE = 15V, TVJ = 150°C, RG = 1Ω
Clamped Inductive Load
TC = 25°C
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
50/60 Hz, 1 Minute
Mounting Force
Maximum Ratings
1200
V
1200
V
±20
V
±30
V
104
A
58
A
480
A
50
A
1.2
J
ICM = 200
A
≤ @VCE VCES
484
W
-55 ... +175
°C
175
°C
-55 ... +175
°C
300
°C
260
°C
2500
V~
20..120/4.5..27
5
N/lb.
g
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
BVCES
IC = 250μA, VGE = 0V
VGE(th)
IC = 250μA, VCE = VGE
ICES
VCE = VCES, VGE = 0V
TJ = 150°C
IGES
VCE = 0V, VGE = ±20V
VCE(sat)
IC = 100A, VGE = 15V, Note 1
TJ = 150°C
Characteristic Values
Min. Typ. Max.
1200
V
3.0
5.0 V
25 μA
1.25 mA
±100 nA
2.9
3.5 V
4.1
V
VCES =
IC110
=
V ≤ CE(sat)
tfi(typ) =
1200V
58A
3.5V
110ns
ISOPLUS247TM
G
CE
Isolated Tab
G = Gate
E = Emitter
C = Collector
Features
z Optimized for Low Switching Losses
z Square RBSOA
z Silicon Chip on Direct-Copper Bond
(DCB) Substrate
z Isolated Mounting Surface
z 2500V~ Electrical Isolation
z Positive Thermal Coefficient of
Vce(sat)
z Avalanche Rated
z High Current Handling Capability
Advantages
z High Power Density
z Low Gate Drive Requirement
Applications
z High Frequency Power Inverters
z UPS
z Motor Drives
z SMPS
z PFC Circuits
z Battery Chargers
z Welding Machines
z Lamp Ballasts
© 2012 IXYS CORPORATION, All Rights Reserved
DS100406B(03/13)