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IXTR62N15P Datasheet, PDF (1/2 Pages) IXYS Corporation – N-Channel Enhancement Mode
Preliminary Technical Information
PolarHTTM Power
MOSFET
(Electrically Isolated Tab)
N-Channel Enhancement Mode
Avalanche Rated
IXTC 62N15P
IXTR 62N15P
VDSS =
ID25 =
RDS(on) ≤
150
36
45
V
A
mΩ
Symbol
VDSS
VDGR
VGS
VGSM
ID25
IDM
IAR
EAR
EAS
dv/dt
PD
T
J
TJM
Tstg
TL
F
C
Weight
Test Conditions
TJ = 25° C to 150° C
TJ = 25° C to 150° C; RGS = 1 MΩ
Continuous
Transient
TC = 25° C
TC = 25° C, pulse width limited by TJM
TC = 25° C
TC = 25° C
TC = 25° C
IS ≤IDM, di/dt ≤100 A/µs, VDD ≤VDSS,
TJ ≤150° C, RG = 10 Ω
TC = 25° C
1.6 mm (0.062 in.) from case for 10 s
Mounting force
ISOPLUS220
ISOPLUS247
ISOPLUS220
ISOPLUS247
Maximum Ratings
150
V
150
V
± 20
V
± 30
V
36
A
150
A
50
A
30
mJ
1.0
J
10
V/ns
150
W
-55 ... +175
°C
150
°C
-55 ... +150
°C
300
°C
11..65 / 2.5..15
N/lb
20..120 / 4.5..25
N/lb
3
g
5
g
Symbol
Test Conditions
(TJ = 25° C unless otherwise specified)
BV
DSS
V
GS
=
0
V,
I
D
=
250
µA
Characteristic Values
Min. Typ. Max.
150
V
VGS(th)
VDS = VGS, ID = 250 µA
3.0
5.0 V
IGSS
VGS = ± 20 VDC, VDS = 0
± 100 nA
IDSS
VDS = VDSS
V =0V
GS
T
J
=
125°
C
10 µA
200 µA
RDS(on)
VGS = 10 V, ID = 31 A, Note 1
45 m Ω
ISOPLUS220 (IXTC)
E153432
G
DS
Isolated back surface
ISOPLUS247 (IXTR)
E153432
G
D
S
G = Gate
S = Source
Isolated back surface
D = Drain
TAB = Drain
Features
l International standard isolated
packages
l UL recognized packages
l Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
l Unclamped Inductive Switching (UIS)
rated
l Low package inductance
- easy to drive and to protect
l Fast intrinsic diode
Advantages
l Easy to mount
l Space savings
l High power density
© 2006 IXYS All rights reserved
DS99622E(05/06)