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IXTR32P60P Datasheet, PDF (1/5 Pages) IXYS Corporation – P-Channel Enhancement Mode Avalanche Rated
Preliminary Technical Information
PolarPTM
Power MOSFET
P-Channel Enhancement Mode
Avalanche Rated
IXTR32P60P
VDSS =
ID25 =
≤ RDS(on)
- 600V
- 18A
385mΩ
ISOPLUS247 (IXTR)
E153432
Symbol
VDSS
VDGR
VGSS
VGSM
ID25
IDM
IAR
EAS
dV/dt
PD
TJ
TJM
Tstg
TL
TSOLD
VISOL
Md
Weight
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
Continuous
Transient
Maximum Ratings
- 600
V
- 600
V
±20
V
±30
V
TC = 25°C
TC = 25°C, pulse width limited by TJM
TC = 25°C
TC = 25°C
-18
A
- 90
A
- 32
A
3.5
J
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
TC = 25°C
10
310
-55 ... +150
150
-55 ... +150
V/ns
W
°C
°C
°C
1.6mm (0.062 in.) from case for 10s
300
Plastic body for 10s
260
50/60 Hz, RMS
t = 1min
2500
IISOL ≤ 1mA
Mounting force
t = 1s
3000
20..120/4.5..27
°C
°C
V~
V~
N/lb.
5
g
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
BVDSS
VGS = 0V, ID = - 250μA
VGS(th)
VDS = VGS, ID = - 250μA
IGSS
VGS = ±20V, VDS = 0V
IDSS
VDS = VDSS
VGS = 0V
RDS(on)
VGS = -10V, ID = -16A, Note 1
TJ = 125°C
Characteristic Values
Min. Typ. Max.
- 500
V
- 2.5
- 4.5 V
±100 nA
- 50 μA
- 250 μA
385 mΩ
Isolated Tab
G = Gate D = Drain
S = Source
Features
z Silicon chip on Direct-Copper Bond
(DCB) substrate
- UL recognized package
- Isolated mounting surface
- 2500V electrical isolation
z Avalanche rated
z The rugged PolarPTM process
z Low QG
z Low Drain-to-Tab capacitance
z Low package inductance
- easy to drive and to protect
Applications
z High side switching
z Push-pull amplifiers
z DC Choppers
z Automatic test equipment
z Load-Switch Application
z Fuel Injection Systems
© 2008 IXYS CORPORATION, All rights reserved
DS99992(05/08)