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IXTH13N110 Datasheet, PDF (1/2 Pages) IXYS Corporation – MEGA MOS FET
MegaMOSTMFET
N-Channel Enhancement Mode
IXTH 13N110
VDSS
ID25
RDS(on)
= 1100 V
= 13 A
= 0.92 Ω
Symbol
Test Conditions
VDSS
VDGR
V
GS
VGSM
I
D25
IDM
PD
T
J
TJM
T
stg
Md
Weight
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
Continuous
Transient
T
C
= 25°C
TC = 25°C, pulse width limited by TJM
TC = 25°C
Mounting torque
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Maximum Ratings
1100
V
1100
V
±20
V
±30
V
13
A
52
A
360
W
-55 ... +150
°C
150
°C
-55 ... +150
°C
1.13/10 Nm/lb.in.
6
g
300
°C
TO-247 AD
D (TAB)
G = Gate,
S = Source,
D = Drain,
TAB = Drain
Features
l International standard package
JEDEC TO-247 AD
l Low RDS (on) HDMOSTM process
l Rugged polysilicon gate cell structure
l Fast switching times
Symbol
VDSS
V
GS(th)
IGSS
IDSS
R
DS(on)
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
VGS = 0 V, ID = 3 mA
V
DS
=
V,
GS
I
D
=
250
µA
VGS = ±20 VDC, VDS = 0
VDS = 0.8 • VDSS
V =0V
GS
TJ = 25°C
T
J
=
125°C
V = 10 V, I = 0.5 • I
GS
D
D25
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
1100
2
V
4.5 V
±100 nA
500 µA
3 mA
0.80 0.92 Ω
Applications
l Switch-mode and resonant-mode
power supplies
l Motor controls
l Uninterruptible Power Supplies (UPS)
l DC choppers
Advantages
l Easy to mount with 1 screw
(isolated mounting screw hole)
l Space savings
l High power density
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
92781F (3/98)
1-2