IXGK82N120B3 Datasheet, PDF (1/6 Pages) IXYS Corporation – GenX3 1200V IGBTs

Advance Technical Information
GenX3^TM 1200V
IGBTs
IXGK82N120B3
IXGX82N120B3
High-Speed Low-Vsat PT IGBTs
for 3 - 20 kHz Switching
V_CES =
I_C110 =
V_CE(sat) ≤
1200V
82A
3.20V
TO-264 (IXGK)
Symbol
V_CES
V_CGR
V_GES
V_GEM
I_C25
I_C110
I_LRMS
I_CM
I_A
E_AS
SSOA
(RBSOA)
P_C
T_J
T_JM
T_stg
T_L
T_SOLD
M_d
F_C
Weight
Test Conditions
Maximum Ratings
T_J = 25°C to 150°C
T_J = 25°C to 150°C, R_GE = 1MΩ
Continuous
Transient
1200
V
1200
V
±20
V
±30
V
T_C = 25°C ( Chip Capability )
T_C = 110°C
T_C = 25°C ( Lead RMS Limit )
T_C = 25°C, 1ms
T_C = 25°C
T_C = 25°C
V_GE= 15V, T_VJ = 125°C, R_G = 2Ω
Clamped Inductive Load
T_C = 25°C
230
A
82
A
120
A
500
A
41
A
750
mJ
I_CM = 164
A
V_CE < V_CES
1250
W
-55 ... +150
°C
150
°C
-55 ... +150
°C
Maximum Lead Temperature for Soldering
300
°C
1.6 mm (0.062 in.) from Case for 10
260
°C
Mounting Torque ( IXGK )
Mounting Force ( IXGX )
1.13/10
20..120/4.5..14.6
Nm/lb.in.
N/lb.
TO-264
PLUS247
10
g
6
g
Symbol
Test Conditions
(T_J = 25°C, Unless Otherwise Specified)
BV_CES
I_C = 250μA, V_CE = 0V
V_GE(th)
I_C = 1mA, V_CE = V_GE
I_CES
V_CE = V_CES, V_GE = 0V
T_J = 125°C, Note 1
I_GES
V_CE = 0V, V_GE = ± 20V
V_CE(sat)
I_C = I_C110, V_GE = 15V, Note 2
T_J = 125°C
Characteristic Values
Min. Typ. Max.
1200
V
3.0
5.0 V
50 μA
5 mA
±100 nA
2.70 3.20 V
2.64
V
G
C
EE
PLUS247^TM (IXGX)
(TAB)
G
C
E
G = Gate
C = Collector
(TAB)
E = Emitter
TAB = Collector
Features
z _{Optimized for Low Conduction and}
Switching Losses
z _{Square RBSOA}
z _{High Avalanche Capability}
z _{International Standard Packages}
Advantages
z _{High Power Density}
z _{Low Gate Drive Requirement}
Applications
z _{Power Inverters}
z _UPS
z _SMPS
z _{PFC Circuits}
z _{Welding Machines}
z _{Lamp Ballasts}
© 2009 IXYS CORPORATION, All Rights Reserved
DS100155(05/09)