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IXFX55N50F Datasheet, PDF (1/4 Pages) IXYS Corporation – HiPerRFTM Power MOSFETs
HiPerRFTM
Power MOSFETs
F-Class: MegaHertz Switching
IXFX 55N50F
IXFK 55N50F
N-Channel Enhancement Mode
Avalanche Rated,
High dV/dt, Low t
Low
Qg,
Low
Intrinsic
Rg
rr
VDSS = 500 V
ID25 = 55 A
RDS(on) = 85 mΩ
t
rr
≤
250
ns
PLUS 247TM (IXFX)
Symbol
VDSS
VDGR
VGS
VGSM
ID25
IDM
IAR
EAR
EAS
dv/dt
PD
TJ
TJM
Tstg
TL
Md
Weight
Symbol
VDSS
VGS(th)
IGSS
IDSS
RDS(on)
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
Continuous
Transient
TC = 25°C
TC = 25°C, pulse width limited by TJM
TC = 25°C
TC = 25°C
TC = 25°C
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
T
J
≤
150°C,
R
G
=
2
Ω
TC = 25°C
1.6 mm (0.063 in.) from case for 10 s
Mounting torque TO-264
PLUS 247
TO-264
Maximum Ratings
500
V
500
V
±20
V
±30
V
55
A
220
A
55
A
60
mJ
3.0
J
10 V/ns
560
W
-55 ... +150
°C
150
°C
-55 ... +150
°C
300
°C
0.4/6 Nm/lb.in.
6
g
10
g
Test Conditions
VGS = 0 V, ID = 1mA
VDS = VGS, ID = 8mA
VGS = ±20 V, VDS = 0
V =V
DS
DSS
VGS = 0 V
VGS = 10 V, ID = 0.5 • ID25
Note 1
Characteristic Values
(TJ
=
25°C,
unless otherwise specified)
min. typ. max.
500
V
3.0
5.5 V
±200 nA
T=
J
25°C
TJ = 125°C
100 µA
3 mA
85 mΩ
G
D
TO-264 AA (IXFK)
(TAB)
G
D
S
(TAB)
G = Gate
S = Source
D = Drain
TAB = Drain
Features
● RF capable Mosfets
● Rugged polysilicon gate cell structure
● Double metal process for low gate
resistance
● Unclamped Inductive Switching (UIS)
rated
● Low package inductance
- easy to drive and to protect
● Fast intrinsic rectifier
Applications
● DC-DC converters
● Switched-mode and resonant-mode
power supplies, >500kHz switching
● DC choppers
● Pulsegeneration
● Laser drivers
Advantages
● PLUS 247TM package for clip or spring
mounting
● Space savings
● High power density
© 2002 IXYS All rights reserved
98855-A (9/02)