English
Language : 

IXFX32N80Q3 Datasheet, PDF (1/6 Pages) IXYS Corporation – N-Channel Enhancement Mode
HiperFETTM
Power MOSFET
Q3-Class
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Rectifier
IXFK32N80Q3
IXFX32N80Q3
VDSS =
ID25 =
 RDS(on)
trr

800V
32A
270m
300ns
TO-264 (IXFK)
Symbol
VDSS
VDGR
VGSS
VGSM
ID25
IDM
IA
EAS
dv/dt
PD
TJ
TJM
Tstg
TL
TSOLD
Md
FC
Weight
Test Conditions
TJ = 25C to 150C
TJ = 25C to 150C, RGS = 1M
Continuous
Transient
Maximum Ratings
800
V
800
V
30
V
40
V
TC = 25C
TC = 25C, Pulse Width Limited by TJM
TC = 25C
TC = 25C
IS  IDM, VDD  VDSS, TJ  150C
TC = 25C
32
80
32
3
50
1000
-55 ... +150
150
-55 ... +150
A
A
A
J
V/ns
W
C
C
C
Maximum Lead Temperature for Soldering
300
°C
Plastic Body for 10s
260
°C
Mounting Torque (TO-264)
Mounting Force (PLUS247)
1.13/10
20..120 /4.5..27
Nm/lb.in
N/lb
TO-264
PLUS247
10
g
6
g
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
BVDSS
VGS = 0V, ID = 1mA
VGS(th)
VDS = VGS, ID = 4mA
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = 0.8 • VDSS, VGS = 0V
TJ = 125C
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
Characteristic Values
Min. Typ. Max.
800
V
3.0
6.0 V
200 nA
50 A
2 mA
270 m
G
D
S
Tab
PLUS247 (IXFX)
G
D
S
Tab
G = Gate
S = Source
D = Drain
Tab = Drain
Features
 Low Intrinsic Gate Resistance
 Low Package Inductance
 Fast Intrinsic Rectifier
 Low RDS(on) and QG
Advantages
 High Power Density
 Easy to Mount
 Space Savings
Applications
 DC-DC Converters
 Battery Chargers
 Switch-Mode and Resonant-Mode
Power Supplies
 DC Choppers
 Temperature and Lighting Controls
© 2014 IXYS CORPORATION, All Rights Reserved
DS100361B(01/14)