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IXFR44N50Q_03 Datasheet, PDF (1/4 Pages) IXYS Corporation – HiPerFET Power MOSFETs ISOPLUS247, Q-Class
HiPerFETTM
Power MOSFETs
ISOPLUS247TM, Q-Class
IXFR 44N50Q
IXFR 48N50Q
(Electrically Isolated Backside)
N-Channel Enhancement Mode
Avalanche Rated, Low Qg, High dv/dt
VDSS
500 V
500 V
ID25
34 A
40 A
RDS(on)
120 mΩ
110 mΩ
trr ≤ 250 ns
Symbol
VDSS
VDGR
VGS
VGSM
ID25
IDM
IAR
EAR
EAS
dv/dt
PD
TJ
TJM
Tstg
TL
VISOL
Weight
Symbol
VDSS
VGS(th)
IGSS
IDSS
RDS(on)
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
Continuous
Transient
TC = 25°C
TC = 25°C, Note 1
TC = 25°C
TC = 25°C
TC = 25°C
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
TJ ≤ 150°C, RG = 2 Ω
TC = 25°C
1.6 mm (0.063 in.) from case for 10 s
50/60 Hz, RMS t = 1 min
Maximum Ratings
500
500
±20
±30
44N50Q
34
48N50Q
40
44N50Q 176
48N50Q 192
44N50Q
44
48N50Q
48
60
2.5
15
V
V
V
V
A
A
A
A
A
A
mJ
J
V/ns
310
W
-55 ... +150
°C
150
°C
-55 ... +150
°C
300
°C
2500
V~
5
g
Test Conditions
VGS = 0 V, ID = 250µA
VDS = VGS, ID = 4mA
VGS = ±20 V, VDS = 0
VDS = VDSS
VGS = 0 V
VGS = 10 V, ID = IT
Notes 2, 3
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
500
V
2.0
4.0 V
TJ = 125°C
44N50Q
48N50Q
±100 nA
100 µA
2 mA
120 mΩ
110 mΩ
ISOPLUS 247TM
E153432
Isolated backside*
G = Gate
S = Source
D = Drain
* Patent pending
Features
z Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
z Low drain to tab capacitance(<30pF)
z IXYS advanced low Qg process
z Rugged polysilicon gate cell structure
z Rated for Unclamped Inductive Load
Switching (UIS)
z Fast intrinsic diode
Applications
z DC-DC converters
z Battery chargers
z Switched-mode and resonant-mode
power supplies
z DC choppers
z AC motor control
Advantages
z Easy assembly
z Space savings
z High power density
© 2003 IXYS All rights reserved
DS98702D(08/03)